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Electronic Components Datasheet Search |
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PS2625 Datasheet(PDF) 6 Page - NEC |
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PS2625 Datasheet(HTML) 6 Page - NEC |
6 / 8 page ![]() 6 PS2625, PS2626, PS2625L, PS2626L SOLDERING PRECAUTION (1) Infrared reflow soldering • Peak reflow temperature : 235 ˚C or below (Plastic surface temperature) • Reflow time : 30 seconds or less (Time period during which the plastic surface temperature is 210 ˚C) • Number of reflow processes : Three • Flux : Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) INFRARED RAY REFLOW TEMPERATURE PROFILE Peak Temperature 235 ˚C or Lower TIME (s) 60 to 90 s (PRE-HEAT) 120 to 160 ˚C (ACTUAL HEAT) to 10 s 235 ˚C MAX. 210 ˚C to 30 s (2) Dip soldering • Peak temperature : 260 ˚C or lower • Time : 10 s or less • Flux : Rosin-base flux |