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AT-41400 Datasheet(PDF) 2 Page - Agilent(Hewlett-Packard)

Part No. AT-41400
Description  Up to 6 GHz Low Noise Silicon Bipolar Transistor Chip
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Maker  HP [Agilent(Hewlett-Packard)]
Homepage  http://www.home.agilent.com
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AT-41400 Datasheet(HTML) 2 Page - Agilent(Hewlett-Packard)

   
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4-100
AT-41400 Absolute Maximum Ratings
Absolute
Symbol
Parameter
Units
Maximum[1]
VEBO
Emitter-Base Voltage
V
1.5
VCBO
Collector-Base Voltage
V
20
VCEO
Collector-Emitter Voltage
V
12
IC
Collector Current
mA
60
PT
Power Dissipation [2,3]
mW
500
Tj
Junction Temperature
°C
200
TSTG
Storage Temperature
°C
-65 to 200
Thermal Resistance[2,4]:
θ
jc = 95°C/W
Notes:
1. Permanent damage may occur if
any of these limits are exceeded.
2. TMOUNTING SURFACE = 25°C.
3. Derate at 10.5 mW/
°C for
TMOUNTING SURFACE > 153°C.
4. The small spot size of this tech-
nique results in a higher, though
more accurate determination of
θ
jc
than do alternate methods. See
MEASUREMENTS section
“Thermal Resistance” for more
information.
Part Number Ordering Information
Part Number
Devices Per Tray
AT-41400-GP4
100
Note: For more information, see “Tape and Reel Packaging for Semiconductor Devices”.
Electrical Specifications, TA = 25°C
Symbol
Parameters and Test Conditions[1]
Units
Min.
Typ.
Max.
|S21E|
2
Insertion Power Gain; VCE = 8 V, IC = 25 mA
f = 2.0 GHz
dB
12.0
f = 4.0 GHz
6.5
P1 dB
Power Output @ 1 dB Gain Compression
f = 2.0 GHz
dBm
19.0
VCE = 8 V, IC = 25 mA
f= 4.0 GHz
18.5
G1 dB
1 dB Compressed Gain; VCE = 8 V, IC = 25 mA
f = 2.0 GHz
dB
15.0
f = 4.0 GHz
10.5
NFO
Optimum Noise Figure: VCE = 8 V, IC = 10 mA
f = 1.0 GHz
dB
1.3
f = 2.0 GHz
1.6
f = 4.0 GHz
3.0
GA
Gain @ NFO; VCE = 8 V, IC = 10 mA
f = 1.0 GHz
dB
18.5
f = 2.0 GHz
14.5
f = 4.0 GHz
10.5
fT
Gain Bandwidth Product: VCE = 8 V, IC = 25 mA
GHz
9.0
hFE
Forward Current Transfer Ratio; VCE = 8 V, IC = 10 mA
30
150
300
ICBO
Collector Cutoff Current; VCB = 8 V
µA
0.2
IEBO
Emitter Cutoff Current; VEB = 1 V
µA
1.0
CCB
Collector Base Capacitance[2]: VCB = 8 V, f = 1 MHz
pF
0.17
Notes:
1. RF performance is determined by packaging and testing 10 devices per wafer.
2. For this test, the emitter is grounded.


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