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PS2506L-1-E3 Datasheet(PDF) 10 Page - NEC |
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PS2506L-1-E3 Datasheet(HTML) 10 Page - NEC |
10 / 12 page 10 PS2506-1,-2,-4,PS2506L-1,-2,-4 RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature 235 °C (package surface temperature) • Time of temperature higher than 210 °C 30 seconds or less • Number of reflows Three • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) 60 to 90 s (preheating) 210 ˚C 120 to 160 ˚C Time (s) (heating) to 10 s to 30 s 235 ˚C (peak temperature) Recommended Temperature Profile of Infrared Reflow Peak temperature 235 ˚C or below Caution Please avoid to removed the residual flux by water after the first reflow processes. (2) Dip soldering • Temperature 260 °C or below (molten solder temperature) • Time 10 seconds or less • Number of times One • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) |
Similar Part No. - PS2506L-1-E3 |
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Similar Description - PS2506L-1-E3 |
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