Time (5 µs/div)

OUT

Time (10 ms/div)

OUT

TMP302x-Q1

TRIPSET0

TRIPSET1

HYSTSET

GND

OUT

0.1 µF

OUTPUT

1.4 V to 3.6 V

10 k

TMP302A-Q1, TMP302B-Q1, TMP302C-Q1, TMP302D-Q1

SLOS889A – OCTOBER 2014 – REVISED NOVEMBER 2014

www.ti.com

Typical Application (continued)

Figure 11. TMP302x-Q1 Generic Application Schematic

9.2.1 Design Requirements

Designing with the TMP302x-Q1 family of devices is simple, See Figure 10 and Figure 11 for typical circuit

configurations.

9.2.2 Detailed Design Procedure

Determine the threshold temperature and hysteresis required for the application. Connect the TMPSET0,

TMPSET1 and HYSTSET pins according to the application requirements. Refer to Table 1 and Table 2. Use a

10-k

used but must not exceed 100 k

Ω. Place a 0.1-µF bypass capacitor close to the TMP302x-Q1 device to reduce

noise coupled from the power supply.

9.2.3 Application Curves

Figure 12 and Figure 13 show the TMP302A-Q1 power on response with the ambient temperature less than

50°C and greater than 50°C respectively. The TMP302A-Q1 was configured with trip point set to 50°C, .

point. Note that the OUT signal typically requires 35 ms following power on to become valid.

50°C

than 50°C

10

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