NCP3020A, NCP3020B, NCV3020A, NCV3020B

http://onsemi.com

3

Rating

Symbol

Unit

High Side Drive Boost Pin

BST

45

−0.3

V

13.2

−0.3

V

COMP

COMP

5.5

−0.3

V

Feedback

FB

5.5

−0.3

V

High−Side Driver Output

HSDR

40

−0.3

V

Low−Side Driver Output

LSDR

13.2

−0.3

V

Main Supply Voltage Input

40

−0.3

V

Switch Node Voltage

40

−0.6

V

Maximum Average Current

130

mA

Operating Junction Temperature Range (Note 1)

−40 to +140

°C

Maximum Junction Temperature

+150

°C

Storage Temperature Range

−55 to +150

°C

Thermal Characteristics (Note 2)

SOIC−8 Plastic Package

Thermal Resistance Junction−to−Air

165

°C/W

Lead Temperature Soldering (10 sec): Reflow (SMD styles only) Pb−Free

(Note 3)

260 Peak

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. The maximum package power dissipation limit must not be exceeded.

2. When mounted on minimum recommended FR−4 or G−10 board

3. 60−180 seconds minimum above 237°C.