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NE661M04-T2 Datasheet(PDF) 10 Page - NEC |
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NE661M04-T2 Datasheet(HTML) 10 Page - NEC |
10 / 7 page Data Sheet P14909EJ1V0DS00 10 NE661M04 SOLDERING CONDITIONS Solder this product under the following recommended conditions. For soldering methods and conditions other than those recommended, consult NEC. Soldering Method(s) Soldering Conditions Recommended Conditions Symbol Infrared reflow Package peak temperature: 235°C, Time: 30 sec max. (210°C min.), Number of times: twice max., Maximum number of days: None Note IR35-00-2 VPS Package peak temperature: 215°C, Time: 40 sec max. (200°C min.), Number of times: twice max., Maximum number of days: None Note VP15-00-2 Wave soldering Solder bath temperature: 260°C, Time: 10 sec max., Number of times: once, Maximum number of days: None Note WS60-00-1 Note Number of days in storage after the dry pack has been opened. The storage conditions are at 25°C, 65% RH MAX. Caution Do not use two or more soldering methods in combination. For details of the recommended soldering conditions, refer to information document Semiconductor Device Mounting Technology Manual (C10535E). |
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