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NE651R479A-T1 Datasheet(PDF) 7 Page - NEC |
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NE651R479A-T1 Datasheet(HTML) 7 Page - NEC |
7 / 8 page Data Sheet P13670EJ2V0DS00 7 NE651R479A RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235 °C or below, Time: 30 seconds or less (at 210 °C or higher), Count: 2 times or less, Exposure: limit: None Note IR35-00-2 Partial Heating Pin temperature: 260 °C or below, Time: 5 seconds or less (per pin row) Exposure: limit: None Note − Note After opening the dry pack, store it at 25 °C or less and 65 % RH or less for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). |
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