Data Sheet P13670EJ2V0DS00

7

NE651R479A

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions.

For soldering

methods and conditions other than those recommended below, contact your NEC sales representative.

Soldering Method

Soldering Conditions

Recommended Condition Symbol

Infrared Reflow

Package peak temperature: 235

°C or below,

Time: 30 seconds or less (at 210

°C or higher),

Count: 2 times or less,

Exposure: limit: None

Note

IR35-00-2

Partial Heating

Pin temperature: 260

°C or below,

Time: 5 seconds or less (per pin row)

Exposure: limit: None

Note

−

Note After opening the dry pack, store it at 25

°C or less and 65 % RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).