Data Sheet P14067EJ2V0DS00

14

NE3210S01

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions.

For soldering methods and

conditions other than those recommended below, contact your NEC sales representative.

Soldering Method

Soldering Conditions

Recommended Condition Symbol

Infrared Reflow

Package peak temperature: 230 °C or below

Time: 30 seconds or less (at 210 °C)

Count: 1, Exposure limit

IR30-00-1

Partial Heating

Pin temperature: 230 °C

Time: 10 seconds or less (per pin row)

Exposure limit

–

Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).