2 Hellesdon Park Road, Norwich, Norfolk, NR6 5DR • +44 (0)1603 788967 • www.micross.com •

chipcomponents@micross.com

Component Applications:

• Thin Film & Chip Level / Known Good Die (KGD)

• Passive and Active Chip Components

• Opto Electronics and Mechanical Components

Features:

• Static Protective

• Tight Dimensional Pocket Tolerance

• Durable Material Construction

X

Y

A

X

Z

Waffle Tray Diagram

Waffle Tray - Dimensions (mm)

Technical Spec (mm)

X = 7.29mm ±0.13mm pocket size

Y = 4.11mm ±0.13mm pocket size

Z = 1.14mm ±0.08mm pocket depth

A = 7° ±1/2° pocket draft angle

No Cross Slots

Array = 5 X 9 (45)

Overall Tray Size:

Size = 50.67mm ±0.25mm

Height = 3.94mm +0.08mm -0.13mm

Flatness = 0.30mm

Waffle Tray – Dimensions (Inches)

Technical Spec (inches)

X = 0.287” ±0.005” pocket size

Y = 0.162” ±0.005” pocket size

Z = 0.045” ±0.003” pocket depth

A = 7° ±1/2° pocket draft angle

No Cross Slots

Array = 5 X 9 (45)

Overall Tray Size:

Size = 1.995” ±0.010”

Height = 0.155” +0.003” -0.005”

Flatness = 0.012”

Buy M20-287162-45 Waffle Tray Pack Online

Micross Kit Includes – Tray, Lid, Tyvek Paper and Clip

M20-287162-45

2” Square / 50.8mm Square Waffle Tray (BLACK)

Tray Material

Surface Resistivity

Static Delay Time (sec.)

Temperature Limit

Lid Material

Clip Material

Polypropylene with Carbon Powder and Glass Bead

10 - 10

<0.01

70˚C

Polypropylene with Carbon Powder and Glass Bead

Polypropylene with Carbon Powder

1

5