SIR414DP-T1-GE3 datasheet(1/9 Pages) VISHAY

Part #	SIR414DP-T1-GE3

Description	N-Channel 40-V (D-S) MOSFET

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Manufacturer	VISHAY [Vishay Siliconix]

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Vishay Siliconix

SiR414DP

New Product

Document Number: 64727

S09-0319-Rev. A, 02-Mar-09

www.vishay.com

1

N-Channel 40-V (D-S) MOSFET

FEATURES

•

Halogen-free According to IEC 61249-2-21

Definition

•

TrenchFET® Power MOSFET

•

100 % Rg Tested

•

100 % UIS Tested

APPLICATIONS

•

Synchronous Rectification

•

Secondary Side DC/DC

PRODUCT SUMMARY

VDS (V)

RDS(on) (Ω)

ID (A)

a

Qg (Typ.)

40

0.0028 at VGS = 10 V

50

38 nC

0.0032 at VGS = 4.5 V

50

Ordering Information: SiR414DP-T1-GE3 (Lead (Pb)-free and Halogen-free)

1

2

3

4

5

6

7

8

S

G

D

6.15 mm

5.15 mm

PowerPAK® SO-8

Bottom View

N-Channel MOSFET

G

D

S

Notes:

a. Package Limited.

b. Surface Mounted on 1" x 1" FR4 board.

c. t = 10 s.

d. See Solder Profile (www.vishay.com/ppg?64727). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper

(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not

required to ensure adequate bottom side solder interconnection.

e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under Steady State conditions is 65 °C/W.

ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted

Parameter

Symbol

Limit

Unit

Drain-Source Voltage

VDS

40

V

Gate-Source Voltage

VGS

± 20

Continuous Drain Current (TJ = 150 °C)

TC = 25 °C

ID

50a

A

TC = 70 °C

50a

TA = 25 °C

33b, c

TA = 70 °C

26b, c

Pulsed Drain Current

IDM

70

Continuous Source-Drain Diode Current

TC = 25 °C

IS

50a

TA = 25 °C

4.9b, c

Single Pulse Avalanche Current

L = 0.1 mH

IAS

40

Single Pulse Avalanche Energy

EAS

80

mJ

Maximum Power Dissipation

TC = 25 °C

PD

83

W

TC = 70 °C

53

TA = 25 °C

5.4b, c

TA = 70 °C

3.4b, c

Operating Junction and Storage Temperature Range

TJ, Tstg

- 55 to 150

°C

Soldering Recommendations (Peak Temperature)d, e

260

THERMAL RESISTANCE RATINGS

Parameter

Symbol

Typical

Maximum

Unit

Maximum Junction-to-Ambientb, f

t

≤ 10 s

RthJA

18

23

°C/W

Maximum Junction-to-Case (Drain)

Steady State

RthJC

1.0

1.5

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