Lead Free SMD Resettable Fuse

Document No

TRF12OS002A

Issued date

2010/07/09

Page

5/7

TA-I TECHNOLOGY CO., LTD

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

8. Environment

8.1 Operating Conditions

Operating Temperature: -40℃ to 85℃

Device Surface Temperature in Tripped State: 125℃ max

8.2 Environmental Specifications

TEST ITEM

Condition

Resistance Change

Passive aging

85℃,1000hr

±

5% typical

Humidity aging

85℃,85%R.H,1000hr

±

5% typical

Thermal shock

85℃ to -40℃,20times

±

10% typical

Resistance to solvent

MIL-STD-202,Method215

No change

Vibration

MIL-STD-883C,Method2007.1

Condition A

No change

8.3 Solder Reflow Recommendations

‧Recommend reflow methods : IR, vapor phase oven, hot air oven.

‧Devices are not designed to be wave soldered to the bottom side

of the board.

‧Recommended maximum paste thickness is 0.25 mm(0.010 inch).

‧Devices can be cleaned using standard method and solvents.

Note : If reflow temperatures exceed the recommended profile,

devices may not meet the performance requirements.