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L7055-04 Datasheet(PDF) 2 Page - Hamamatsu Corporation

Part # L7055-04
Description  HIGH-POWER INFRARED PULSED LASER DIODE
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Manufacturer  HAMAMATSU [Hamamatsu Corporation]
Direct Link  http://www.hamamatsu.com
Logo HAMAMATSU - Hamamatsu Corporation

L7055-04 Datasheet(HTML) 2 Page - Hamamatsu Corporation

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HIGH-POWER INFRARED PULSED LASER DIODE
L7055-04
Cat. No. LLD1004E02
Jul. 1999 T
Printed in Japan (1,000)
■ELECTRICAL AND OPTICAL CHARACTERISTICS (Ta=25℃)
Figure 4: Typical Directivity
HIGH-POWER
INFRARED PULSED LASER DIODE
L7055-04
■FEATURES
●High output power (φep≦20W)
●High speed rise time (tr=0.5 ns typ.)
■APPLICATIONS
●Laser rader
●Range finder
●Excitation light source
●Optical trigger
●Security barrier
■ABSOLUTE MAXIMUM RATINGS
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. 1998 Hamamatsu Photonics K.K.
http://www.hamamatsu.com
HAMAMATSU PHOTONICS K.K., International Sales Division
325-6, Sunayama-cho, Hamamatsu City, 430-8587, Japan, Telephone: (81)53-452-2141, Fax: (81)53-456-7889
U.S.A.: Hamamatsu Corporation:360 Foothill Road, P.O. BOX 6910, Bridgewater, N.J. 08807-0910, U.S.A.Telephone: (1)908-231-0960, Fax: (1)908-231-1218 E-mail: usa@hamamatsu.com
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-2658, E-mail: info@hamamatsu.de
France: Hamamatsu Photonics France S.A.R.L.: 8, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33(1) 69 53 71 00, Fax: 33(1) 69 53 71 10, E-mail: france@hamamatsu.com
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44)1707-294888, Fax: (44)1707-325777, E-mail: info@hamamatsu.co.uk
North Europe: Hamamatsu Photonics Norden AB: Smidesv gen 12, SE-171-41 Solna, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01, E-mail: info@hamamatsu.se
Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1/E, 20020 Arese, (Milano), Italy, Telephone: (39)02-935 81 733, Fax: (39)02-935 81 741, E-mail: info@hamamatsu.it
Figure 2: Typical Radiant Power vs.
Pulsed Forward Current
Figure 3: Typical Emission Spectrum
Unit
W
nm
nm
V
ns
degree
degree
A
Min.
20
-
-
-
-
6
29
-
Symbol
IFP
VR
φep
tw
DR
Top
Tstg
Value
30
2
40
100
0.075
-30 to +85
-40 to +125
Unit
A
V
W
ns
%
Parameter
Pulsed Radiant Power
Peak Emission Wavelength
Spectral Radiation Half Bandwidth
Forward Voltage
Rise Time
Beam Spread Angle : Parallel
: Vertical
Lasing Threshold Current
Symbol
φep
λp
Δλ
VF
tr
θ//
θ⊥
Ith
Condition
IFP=20A
IFP=20A
FWHM
IFP=20A
Typ.
-
870
4
6
0.5
8
32
1
Max.
-
-
-
-
-
10
35
-
Note: General operating condition
φep≦20 W, tw≦50 ns, Repetition frequency≦8 kHz
Parameter
Pulsed Foward Current
Reverse Voltage
Pulsed Radiant Output Power
Pulse Duration (FWHM)
Duty Ratio
Operating Temperature
Storage Temperature
Figure 1: Dimensional Outline (Unit: mm)
Handling Precautions for L7055-04
1. Precautions for handling
The LD (laser diode) may be damaged or its performance may deteriorate
due to such factors as electrostatic discharge from the human body, surge
voltages from measurement equipment, leakage voltages from soldering
irons, and packing materials. As a countermeasure against static electricity,
the device, operator, work place and measuring jigs must all be set at the
same electric potential. In using LD, observe the following precautions:
・To protect the device from static electricity charges which accumulate on
the operator or the operator’s clothes, use a wrist strap etc. to ground the
operator’s body via a high impedance resistor (1M
Ω).
・A semiconductive sheet should be laid on both the work table and the
floor in the work area. When soldering, use an electrically grounded solder-
ing iron with an isolation resistance of more than 10M
Ω.
・For containers for transportation and packing, use of antistatic material
(material that minimizes the generation of static change when rubbed
against or separated from itself or other similar materials).
2. Precautions for mounting
(1)Lead forming
To form the leads, hold the base of the leads securely and bend them so
that no force is applied to the package. Lead forming should be done be-
fore soldering.
(2)Cutting off the leads
If leads are out when still at a high temperature, this may cause an electri-
cal discontinuity. Always cut off the leads when they are at room tempera-
ture. Never cut off the leads immediately after they are soldered.
(3)Soldering
Using a low-temperature melting solder (below 200
℃), solder the leads
at the temperature and dwell time specified as follows.
Maximum Soldering Temperature: 230
Maximum Soldering Time: 5 seconds (1 second for devices having a
lead length less than 2mm)
If these conditions cannot be met, it is recommended that some form of
heat sink be used at the base of the lead so that the solder heat is not
conducted to the package. Also be careful not to apply excessive force to
the leads during soldering.
Soldering at excessive temperatures and dwell times may cause the
roots of the leads to crack, resulting in performance deterioration. This
sometimes leads to wiring breakage. If the leads are soldered while exter-
nal force is applied to the device, the residual force tends to degrade de-
vice performance. Care should also be taken not to apply force to the
leads during soldering.
In addition, when soldering an LD. use a soldering iron with its metallic
parts grounded to prevent damage to the device from static discharge.
Do not use any flux which is highly acidic. alkaline or inorganic because
it may cause the component leads to erode.
Use a rosin flux.
3.Protection against laser beams
The LD is classified into class 3B according to the laser product stan-
dards of the lEC825-1 (Radiation safety of laser products Part1: Equip-
ment classification, requirements and user’s guide). The operator must
avoid eye or skin exposure to the laser beam. When viewing the laser
beam, be sure to wear safety goggles that block infrared radiation.
PULSED FORWARD CURRENT IFP (A)
WAVELENGTH (nm)
ANGLE (degree)
Top View
Top View
(Ta=25
℃)
100
80
60
40
20
0
870
890
910
830
850
(Ta=25
℃)
80
60
100
40
20
0
30
40
20
10
0
10
20
30
40
(IFP=20 A, Ta=25
℃)
Vertical Direction
Parallel
Direction
9.0
  
Side View
Bottom View
5.7 ± 0.2
2.54
1.0
0.45
2.8 ± 0.3
Glass Window
LD Chip
NC (Case)
Cathode
Anode
+0
-0.1
(Pin Connection)
Anode
Cathode
40
30
20
10
0
010
20
30
C
Top View
Top View


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