TA -I

Alloy Film Chip Resistors

Low Resistance (Standard)

Halogen-Free

Document No TRL-XX0S001O

Issued date

2014/08/06

Page.

3 / 10

TA-I TECHNOLOGY CO., LTD

5.1 Derating Curve :

For resistors operated at ambient temperature over 70℃ , power rating shall be derated in

accordance with figure 1.

P Max

Ambient Temp.(℃)

Figure 1

6. Reliability Test :

Test Item

Reference

standard

Condition of Test

Test Limits

Temperature Coefficient of

Resistance

IEC60115-1-4.8

JIS-C5201-1-4.8

-55 ~ +125℃

Refer to paragraph 5

Short Time Overload

IEC60115-1-4.13

JIS-C5201-1-4.13

2.5 X rated voltage, 5s

1%:

 (1%+0.005  )

2%,5%:

 (3%+0.005  )

Remark: 0402

(2%+0.005  )

Load Life

IEC60115-1-4.25.1

JIS-C5201-1-4.25.1

1000 hours at rated power ,

70℃, 1.5hours “ON “, 0.5hour “OFF”

1%:

 (1%+0.001  )

2%,5%:

 (3%+0.001  )

Remark: 0402

Load Life with Humidity

IEC60115-1-4.24

JIS-C5201-1-4.24

1000 hours at rated power ,

40

 2℃, 90~95% RH

1.5hours “ON “, 0.5hour “OFF”

1%:

 (1%+0.001  )

2%,5%:

 (3%+0.001  )

Remark: 0402

Rapid Change of

Temperature

IEC60115-1-4.19

JIS-C5201-1-4.19

-55℃ (30 min. ) / +155 ℃(30 min.)

5 cycles

 1%+0.005 

Resistance to Soldering Heat

IEC60115-1-4.18

JIS-C5201-1-4.18

270

 5℃ solder , 10  1 sec dwell .  1%+0.005 

Solderability

IEC60115-1-4.17

JIS-C5201-1-4.17

245±5℃ solder, 2±0.5 sec dwell.

Solder : Sn96.5 / Ag3.0 / Cu0.5

At least 95% of surface area

of electrode shall be covered with

new solder.

Robustness of Termination

(Bending Strength)

IEC60115-1-4.33

JIS-C5201-1-4.33

3mm deflection

2mm deflection (RL20,25)

 1%+0.005Ω

Resistance to Dry Heat

IEC60115-1-4.23.2

1%:

 (1%+0.005  )

2%,5%:

 (2%+0.005  )

Note* :RCWV : Rated continuous working voltage .

Power ratio(%)