Alloy Film

Low Resistance Chip Resistors

(RBL Series)

Document No

TRBL-XX0S001K

Issued date

2014/06/12

Page

8/9

TA-I TECHNOLOGY CO., LTD

14. Storage Conditions:

Temperature: 5℃~35℃,Humidity:40%~75%

15. Shelf Life:

2 years from manufacturing date.

16. Recommend IR

Profile Feature

Lead (Pb )-Free Assembly

Average ramp-up rate

(Tsmax to Tp)

3℃ / second max.

Preheat

- Temperature Min

150℃

200℃

60 -150 seconds

Time maintained above :

- Temperature

217℃

60-120 seconds

Peak Temperature (Tp)

260℃

Time within

5

0





℃ of actual Peak

Temperature (tp)

2

10 seconds

Ramp-down Rate

6℃/second max.

Time 25℃ to Peak Temperature

8mimutes max.

Alloyed Re-flow times : 3 times

Remark : To avoid discoloration phenomena of chip on terminal electrodes,

please use N2 Re-flow furnace