214

Revised: July 29, 2010 09:54 AM

©2010 Littelfuse, Inc

Specifications are subject to change without notice.

Please refer to http://www.littelfuse.com for current information.

4 Amp Sensitive SCRs

Sxx04xSx Series

Soldering Parameters

Reflow Condition

Pre Heat

- Temperature Min (T

150°C

- Temperature Max (T

200°C

- Time (min to max) (t

Average ramp up rate (Liquidus Temp)

(T

5°C/second max

T

5°C/second max

Reflow

- Temperature (T

217°C

- Temperature (t

Peak Temperature (T

Time within 5°C of actual peak

Temperature (t

Ramp-down Rate

5°C/second max

Time 25°C to peak Temperature (T

8 minutes Max.

Do not exceed

280°C

Physical Specifications

Environmental Specifications

Test

Specifications and Conditions

AC Blocking

MIL-STD-750, M-1040, Cond A Applied

Peak AC voltage @ 125°C for 1008 hours ,

R

= 1kohms

Temperature Cycling

MIL-STD-750, M-1051,

100 cycles; -40°C to +150°C;

15-min dwell-time

Temperature/

Humidity

EIA / JEDEC, JESD22-A101

85% rel humidity

High Temp Storage

MIL-STD-750, M-1031,

1008 hours; 150°C

Low-Temp Storage

1008 hours; -40°C

Thermal Shock

MIL-STD-750, M-1056

10 cycles; 0°C to 100°C; 5-min dwelltime

at each temperature; 10 sec (max) transfer

time between temperature

Autoclave

EIA / JEDEC, JESD22-A102

168 hours (121°C at 2 ATMs) and

Resistance to

Solder Heat

MIL-STD-750 Method 2031

Solderability

ANSI/J-STD-002, category 3, Test A

Lead Bend

MIL-STD-750, M-2036 Cond E

Terminal Finish

100% Matte Tin-plated

Body Material

Lead Material

Copper Alloy

Design Considerations

Careful selection of the correct device for the application’s

operating parameters and environment will go a long way

design practice should limit the maximum continuous

current through the main terminals to 75% of the device

rating. Other ways to ensure long life for a power discrete

semiconductor are proper heat sinking and selection of

voltage ratings for worst case conditions. Overheating,

overvoltage (including dv/dt), and surge currents are

the main killers of semiconductors. Correct mounting,

soldering, and forming of the leads also help protect

against component damage.

Time

25

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do