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S6004DS2RP Datasheet(PDF) 6 Page - Littelfuse |
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S6004DS2RP Datasheet(HTML) 6 Page - Littelfuse |
6 / 9 page 214 Revised: July 29, 2010 09:54 AM ©2010 Littelfuse, Inc Teccor® brand Thyristors Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 4 Amp Sensitive SCRs Sxx04xSx Series Soldering Parameters Reflow Condition Pre Heat - Temperature Min (T s(min)) 150°C - Temperature Max (T s(max)) 200°C - Time (min to max) (t s) Average ramp up rate (Liquidus Temp) (T L) to peak 5°C/second max T S(max) to TL - Ramp-up Rate 5°C/second max Reflow - Temperature (T L) (Liquidus) 217°C - Temperature (t L) Peak Temperature (T P) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) Ramp-down Rate 5°C/second max Time 25°C to peak Temperature (T P) 8 minutes Max. Do not exceed 280°C Physical Specifications Environmental Specifications Test Specifications and Conditions AC Blocking MIL-STD-750, M-1040, Cond A Applied Peak AC voltage @ 125°C for 1008 hours , R = 1kohms Temperature Cycling MIL-STD-750, M-1051, 100 cycles; -40°C to +150°C; 15-min dwell-time Temperature/ Humidity EIA / JEDEC, JESD22-A101 85% rel humidity High Temp Storage MIL-STD-750, M-1031, 1008 hours; 150°C Low-Temp Storage 1008 hours; -40°C Thermal Shock MIL-STD-750, M-1056 10 cycles; 0°C to 100°C; 5-min dwelltime at each temperature; 10 sec (max) transfer time between temperature Autoclave EIA / JEDEC, JESD22-A102 168 hours (121°C at 2 ATMs) and Resistance to Solder Heat MIL-STD-750 Method 2031 Solderability ANSI/J-STD-002, category 3, Test A Lead Bend MIL-STD-750, M-2036 Cond E Terminal Finish 100% Matte Tin-plated Body Material Lead Material Copper Alloy Design Considerations Careful selection of the correct device for the application’s operating parameters and environment will go a long way design practice should limit the maximum continuous current through the main terminals to 75% of the device rating. Other ways to ensure long life for a power discrete semiconductor are proper heat sinking and selection of voltage ratings for worst case conditions. Overheating, overvoltage (including dv/dt), and surge currents are the main killers of semiconductors. Correct mounting, soldering, and forming of the leads also help protect against component damage. Time TP TL TS(max) TS(min) 25 tP tL tS time to peak temperature Preheat Preheat Ramp-up Ramp-up Ramp-down Ramp-do |
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