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RG3G Datasheet(PDF) 1 Page - General Semiconductor |
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RG3G Datasheet(HTML) 1 Page - General Semiconductor |
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1 / 2 page  RG3A THRU RG3M GLASS PASSIVATED FAST SWITCHING RECTIFIER Reverse Voltage - 50 to 1000 Volts Forward Current - 3.0 Amperes FEATURES ♦ High temperature metallurgically bonded construction ♦ Glass passivated cavity-free junction ♦ Hermetically sealed package ♦ 3.0 Ampere operation at TA=55°C with no thermal runaway ♦ Typical IR less than 0.1µA ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ Fast switching for high efficiency ♦ High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension MECHANICAL DATA Case:Solid glass body Terminals: Solder plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.04 ounce, 1.1 grams MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS RG3A RG3B RG3D RG3G RG3J RG3K RG3M UNITS Maximum repetitive peak reverse voltage VRRM 50 100 220 400 600 800 1000 Volts Maximum RMS voltage VRMS 35 70 140 280 420 560 700 Volts Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 Volts Maximum average forward rectified current 0.375" (9.5mm) lead length at TA=55°C I(AV) 3.0 Amps Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 100.0 Amps Maximum instantaneous forward voltage at 3.0A VF 1.3 Volts Maximum average reverse current TA=25°C 2.0 at rated peak reverse voltage TA=100°C IR(AV) 100.0 µA Maximum DC reverse current at rated DC blocking voltage IR 5.0 µA Maximum reverse recovery time (NOTE 1) trr 150 250 400 500 ns Typical junction capacitance (NOTE 2) CJ 40.0 pF Typical thermal resistance (NOTE 3) R ΘJA 22.0 °C/W Operating junction and storage temperature range TJ, TSTG -65 to +175 °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Ir=0.25A (2) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, with both leads attached to heat sink 4/98 Dimensions in inches and (millimeters) *Brazed-lead assembly is covered by Patent No. 3,930,306 0.250 (6.3) 0.170 (4.3) 0.052 (1.32) 0.048 (1.22) DIA. DIA. 1.0 (25.4) MIN MAX. 0.300 (7.6) 1.0 (25.4) MIN Case Style G3 |
Similar Part No. - RG3G |
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Similar Description - RG3G |
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