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SG78XXK883B Datasheet(PDF) 2 Page - Microsemi Corporation |
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SG78XXK883B Datasheet(HTML) 2 Page - Microsemi Corporation |
2 / 8 page SG78xxA/78xx PRODUCT DATASHEET Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 Copyright © 1997 Rev. 1.5, 2010-07-13 TM ® Positive Fixed Voltage Regulator ABSOLUTE MAXIMUM RATINGS Device Output Voltage Input Voltage Input Voltage (Transient)(Note 3) Input Voltage Differential (Output Shorted to Ground) 5V 35V 50V 35V 12V 35V 50V 35V 15V 35V 50V 35V Operating Junction Temperature .........................................................................................................................................................150°C Storage Temperature Range ................................................................................................................................................. -65 °C to 150°C Lead Temperature (Soldering 10 seconds) ..........................................................................................................................................300 °C Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal . Note 3: Operation at high input voltages is dependent upon load current. When load current is less than 5mA, output will rise out of regulation as input- output differential increases beyond 30V. Note also from figure 1, that maximum load current is reduced at high voltages. The 50V input rating of the SG78xxA series refers to ability to withstand high line or transient conditions without damage. Since the regulator’s maximum current capability is reduced, the output may fall out of regulation at high input voltages under nominal loading. THERMAL DATA K TO-3 3-Terminal Metal Can (Two pins and case) THERMAL RESISTANCE -JUNCTION TO CASE, θ JC 3.0 °C/W THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 35 °C/W T TO-39 3-Pin Metal Can THERMAL RESISTANCE -JUNCTION TO CASE, θ JC 15 °C/W THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 120 °C/W G TO-257 3-Pin Hermetic THERMAL RESISTANCE -JUNCTION TO CASE, θ JC 3.5 °C/W THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 42 °C/W IG TO-257 3-Pin Hermetic (Isolated) THERMAL RESISTANCE -JUNCTION TO CASE, θ JC 4.0 °C/W THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 42 °C/W L Leadless Chip Carrier 20-Pin Ceramic THERMAL RESISTANCE -JUNCTION TO CASE, θ JC 35 °C/W THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 120 °C/W Junction Temperature Calculation: TJ = TA + (PD x θJA). The θ JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. |
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