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MB2S Datasheet(PDF) 1 Page - General Semiconductor |
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MB2S Datasheet(HTML) 1 Page - General Semiconductor |
1 / 2 page MB2S THRU MB6S MINIATURE GLASS PASSIVATED SINGLE-PHASE SURFACE MOUNT BRIDGE RECTIFIER Reverse Voltage - 200 to 600 Volts Forward Current - 0.5 Ampere FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ This series is UL recognized under Component Index, file number E54214 ♦ Glass passivated chip junctions ♦ High surge overload rating: 35A peak ♦ Saves space on printed circuit boards ♦ High temperature soldering guaranteed: 260°C/10 seconds at 5 lbs. (2.3kg) tension MECHANICAL DATA Case: Molded plastic body over passivated junctions Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: Polarity symbols marked on body Mounting Position: Any Weight: 0.0078 ounce, 0.22 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS MB2S MB4S MB6S UNITS Device marking code 2 4 6 Maximum repetitive peak reverse voltage VRRM 200 400 600 Volts Maximum RMS voltage VRMS 140 280 420 Volts Maximum DC blocking voltage VDC 200 400 600 Volts Maximum average forward output rectified current at TA=30°C - on glass-epoxy P.C.B. (NOTE 1) I(AV) 0.5 Amp - on aluminum substrate (NOTE 2) 0.8 Peak forward surge current 8.3msec single half sine- wave superimposed on rated load (JEDEC Method) IFSM 35.0 Amps Rating for fusing (t<8.3ms) I2t 5.0 A2sec Maximum instantaneous forward voltage drop per leg at 0.4A VF 1.0 Volts Maximum DC reverse current at TA=25°C 5.0 µA rated DC blocking voltage per leg TA=125°C IR 100 Typical junction capacitance per leg (NOTE 3) CJ 13.0 pF Typical thermal resistance per leg (NOTE 1) R ΘJA 85.0 (NOTE 2) R ΘJA 70.0 °C/W (NOTE 1) R ΘJL 20.0 Operating junction and storage temperature range TJ, TSTG -55 to +150 °C NOTES: (1) On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads (2) On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad (3) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts 0.029 (0.74) 0.017 (0.43) 0-8 o 0.049 (1.24) 0.039 (0.99) 0.062 (1.57) 0.058 (1.47) 0.016 (0.41) 0.006 (0.15) 0.018 (0.46) 0.014 (0.36) 0.008 (0.20) 0.004 (0.10) 0.117 (2.97) 0.107 (2.72) 0.058 (1.47) 0.054 (1.37) 0.252 (6.40) 0.272 (6.90) 0.106 (2.70) 0.090 (2.30) 0.0075 (0.19) 0.0065 (0.16) 0.105 (2.67) 0.095 (2.41) 0.195 (4.95) 0.179 (4.55) 0.144 (3.65) 0.161 (4.10) 0.205 (5.21) 0.195 (4.95) 0.114 (2.90) 0.094 (2.40) 0.038 (0.96) 0.019 (0.48) TO-269AA Dimensions in inches and (millimeters) PATENT PENDING PATENT PENDING PATENT PENDING 4/98 |
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