Electronic Components Datasheet Search |
|
JAN1N6461 Datasheet(PDF) 6 Page - Microsemi Corporation |
|
JAN1N6461 Datasheet(HTML) 6 Page - Microsemi Corporation |
6 / 6 page T4-LDS-0286-1, Rev. 1 (4/22/13) ©2013 Microsemi Corporation Page 6 of 6 1N6461US – 1N6468US PACKAGE DIMENSIONS NOTES: 1. Dimensions are in inches. 2. Millimeter equivalents are given for information only. 3. Referencing to dimension S, minimum clearance of glass body to mounting surface on all orientations. 4. Dimensions are pre-solider dip. 5. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology. PAD LAYOUT Inch Millimeters Min Max Min Max BL 0.137 0.148 3.48 3.76 BD 0.200 0.225 5.08 5.72 ECT 0.019 0.028 0.48 0.71 S 0.003 --- 0.08 --- INCH MILLIMETERS A 0.288 7.32 B 0.070 1.78 C 0.155 3.94 Note: If mounting requires adhesive separate from the solder, an additional 0.080 inch diameter contact may be placed in the center between the pads as an optional spot for cement. |
Similar Part No. - JAN1N6461 |
|
Similar Description - JAN1N6461 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |