Document Number 88547

26-Jun-06

www.vishay.com

3

BYM11-50 thru BYM11-1000, RGL41A thru RGL41M

Vishay General Semiconductor

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

Figure 3. Typical Instantaneous Forward Characteristics

Figure 4. Typical Reverse Characteristics

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0.01

0.1

1

10

Instantaneous Forward Voltage (V)

Pulse Width = 300 µs

1 % Duty Cycle

0

20

40

60

80

100

0.01

0.1

1

10

Percent of Rated Peak Reverse Voltage (%)

Figure 5. Typical Junction Capacitance

Figure 6. Typical Transient Thermal Impedance

1

10

100

1

10

100

Reverse Voltage (V)

f = 1.0 MHz

0.01

0.1

1

10

100

0.1

1

10

100

Mounted on 0.20 x 0.27" (5 x 7 mm)

Copper Pad Areas

t - Pulse Duration (s)

SOLDERABLE ENDS

1st BAND

0.022 (0.56)

0.018 (0.46)

0.205 (5.2)

0.185(4.7)

D1 =

0.105

0.095

(2.67)

(2.41)

D2 = D1

+ 0

- 0.008 (0.20)

D2

0.022 (0.56)

0.018 (0.46)

DO-213AB

0.138 MAX

(3.5) MAX

0.049 MIN

(1.25) MIN

0.118 MIN

(3.0) MIN

0.238 (6.0)

REF

Mounting Pad Layout

1st band denotes type and positive end (cathode)