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BYM12-300 Datasheet(PDF) 1 Page - General Semiconductor |
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BYM12-300 Datasheet(HTML) 1 Page - General Semiconductor |
1 / 2 page BYM12-50 THRU BYM12-400 EGL41A THRU EGL41G SURFACE MOUNT GLASS PASSIVATED JUNCTION FAST EFFICIENT RECTIFIER Reverse Voltage - 50 to 400 Volts Forward Current - 1.0 Ampere FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ For surface mount applications ♦ High temperature metallurgically bonded construction ♦ Glass passivated cavity-free junction ♦ Fast switching for high efficiency ♦ High temperature soldering guaranteed: 450°C/5 seconds at terminals. Complete device submersible temperature of 260°C for 10 seconds in solder bath MECHANICAL DATA Case: JEDEC DO-213AB molded plastic over glass body Terminals: Plated terminals, solderable per MIL-STD-750, Method 2026 Polarity: Two bands indicate cathode end -1st band denotes device type and 2nd band denotes repetitive peak reverse voltage rating Mounting Position: Any Weight: 0.116 ounce, 0.0046 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. BYM12 BYM12 BYM12 BYM12 BYM12 BYM12 SYMBOLS -50 -100 -150 -200 -300 -400 UNITS Fast efficient device: 1st band is green EGL41A EGL41B EGL41C EGL41D EGL41F EGL41G Polarity color bands (2cnd band) GRAY RED PINK ORANGE BROWN YELLOW Maximum repetitive peak reverse voltage VRRM 50 100 150 200 300 400 Volts Maximum RMS voltage VRMS 35 70 105 140 210 280 Volts Maximum DC blocking voltage VDC 50 100 150 200 300 400 Volts Maximum average forward rectified current at TT=75°C I(AV) 1.0 Amp Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 30.0 Amps Maximum instantaneous forward voltage at 1.0A VF 1.0 1.25 Volts Maximum DC reverse current TA=25°C 5.0 at rated DC blocking voltage TA=125°C IR 50.0 µA Maximum reverse recovery time (NOTE 1) trr 50.0 ns Typical junction capacitance (NOTE 2) CJ 20.0 14.0 pF Maximum thermal resistance (NOTE 3) R ΘJA 60.0 (NOTE 4) R ΘJT 30.0 °C/W Operating junction and storage temperature range TJ, TSTG -65 to +175 °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient, 0.24 x 0.24” (6.0 x 6.0mm) copper pads to each terminal (4) Thermal resistance from junction to terminal, 0.24 x 0.24” (6.0 x 6.0mm) copper pads to each terminal SOLDERABLE ENDS 1st BAND 0.022 (0.56) 0.018 (0.46) 0.205 (5.2) 0.185(4.7) D1= 0.105 0.095 (2.67) (2.41) D2 = D1 + 0 - 0.008 (0.20) 1st band denotes type and positive end (cathode) D2 DO-213AB Dimensions in inches and (millimeters) *Glass-plastic encapsulation is covered by Patent No. 3,996,602 and brazed-lead assembly to Patent No. 3,930,306 2cnd BAND |
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