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ADS7863IDBQG4 Datasheet(PDF) 2 Page - Texas Instruments |
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ADS7863IDBQG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 44 page ADS7863 SBAS383E – JUNE 2007 – REVISED JANUARY 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR ORDERING NUMBER ADS7863IDBQ SSOP-24 DBQ ADS7863IDBQR ADS7863I ADS7863IRGET 4×4 QFN-24 RGE ADS7863IRGER (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. ADS7863 UNIT Supply voltage, AVDD to AGND –0.3 to +6 V Supply voltage, BVDD to BGND –0.3 to +6 V Supply voltage, BVDD to AVDD 1.5 × AVDD V Analog and reference input voltage with respect to AGND AGND – 0.3 to AVDD + 0.3 V Digital input voltage with respect to BGND BGND – 0.3 to BVDD + 0.3 V Ground voltage difference |AGND – BGND| 0.3 V Input current to any pin except supply pins –10 to +10 mA Maximum virtual junction temperature, TJ +150 °C Human body model (HBM), ±4000 V JEDEC standard 22, test method A114-C.01, all pins ESD ratings: Charged device model (CDM), ±1500 V JEDEC standard 22, test method C101, all pins (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability. 2 Submit Documentation Feedback Copyright © 2007–2011, Texas Instruments Incorporated Product Folder Link(s): ADS7863 |
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