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LP38856 Datasheet(PDF) 12 Page - Texas Instruments

Part No. LP38856
Description  3A Fast-Response High-Accuracy LDO Linear Regulator with Enable
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
Logo TI1 - Texas Instruments

LP38856 Datasheet(HTML) 12 Page - Texas Instruments

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Heat-Sinking The DDPAK/TO-263 Package
The DDPAK/TO-263 package has a
θJA rating of 60°C/W, and a θJC rating of 3°C/W. These ratings are for the
package only, no additional heat-sinking, and with no airflow.
The DDPAK/TO-263 package uses the copper plane on the PCB as a heat-sink. The tab of this package is
soldered to the copper plane for heat-sinking. The graph below shows a curve for the
θJA of DDPAK/TO-263
package for different copper area sizes, using a typical PCB with 1 ounce copper and no solder mask over the
copper area for heat-sinking.
Figure 27.
θJA vs Copper (1 Ounce) Area for the DDPAK/TO-263 package
As shown in Figure 27, increasing the copper area beyond 1 square inch produces very little improvement. The
minimum value for
θJA for the DDPAK/TO-263 package mounted to a PCB is 32°C/W.
Figure 28 shows the maximum allowable power dissipation for DDPAK/TO-263 packages for different ambient
temperatures, assuming
θJA is 35°C/W and the maximum junction temperature is 125°C.
Figure 28. Maximum Power Dissipation vs Ambient Temperature for DDPAK/TO-263 package
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Product Folder Links: LP38856

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