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LP38856 Datasheet(PDF) 2 Page - Texas Instruments

Part No. LP38856
Description  3A Fast-Response High-Accuracy LDO Linear Regulator with Enable
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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LP38856 Datasheet(HTML) 2 Page - Texas Instruments

 
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TAB
IS
GND
BIAS
OUT
GND
EN
1
2
3
4
5
IN
TAB
IS
GND
BIAS
OUT
GND
EN
1
2
3
4
5
IN
LP38856
SNVS336D – JUNE 2006 – REVISED OCTOBER 2011
www.ti.com
Connection Diagram
Figure 1. DDPAK/TO-263 – Top View
Figure 2. TO-220 – Top View
See Package Number KTT0005B
See Package Number NDH0005D
PIN DESCRIPTIONS
TO-220–5 and DDPAK/TO-263–5 Packages
Pin #
Pin Symbol
Pin Description
1
EN
The device Enable pin.
2
IN
The unregulated input voltage pin
3
GND
Ground
4
OUT
The regulated output voltage pin
5
BIAS
The supply for the internal control and reference circuitry
The TAB is a thermal connection that is physically attached to the backside of the
TAB
TAB
die, and is used as a thermal heat-sink connection. See the Application Information
section for details
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
Storage Temperature Range
−65°C to +150°C
Lead Temperature Soldering, 5 seconds
260°C
ESD Rating
Human Body Model(2)
±2 kV
Power Dissipation(3)
Internally Limited
VIN Supply Voltage (Survival)
−0.3V to +6.0V
VBIAS Supply Voltage (Survival)
−0.3V to +6.0V
VEN Voltage (Survival)
−0.3V to +6.0V
VOUT Voltage (Survival)
−0.3V to +6.0V
IOUT Current (Survival)
Internally Limited
Junction Temperature
−40°C to +150°C
(1)
Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical
Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions.
(2)
The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-
A114. The HBM rating for device pin 1 (EN) is ±1.5 kV.
(3)
Device power dissipation must be de-rated based on device power dissipation (TD), ambient temperature (TA), and package junction to
ambient thermal resistance (
θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not
exceed the maximum operating rating. See the Application Information section for details.
2
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Copyright © 2006–2011, Texas Instruments Incorporated
Product Folder Links: LP38856


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