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LP38856 Datasheet(PDF) 2 Page - Texas Instruments |
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LP38856 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 20 page TAB IS GND BIAS OUT GND EN 1 2 3 4 5 IN TAB IS GND BIAS OUT GND EN 1 2 3 4 5 IN LP38856 SNVS336D – JUNE 2006 – REVISED OCTOBER 2011 www.ti.com Connection Diagram Figure 1. DDPAK/TO-263 – Top View Figure 2. TO-220 – Top View See Package Number KTT0005B See Package Number NDH0005D PIN DESCRIPTIONS TO-220–5 and DDPAK/TO-263–5 Packages Pin # Pin Symbol Pin Description 1 EN The device Enable pin. 2 IN The unregulated input voltage pin 3 GND Ground 4 OUT The regulated output voltage pin 5 BIAS The supply for the internal control and reference circuitry The TAB is a thermal connection that is physically attached to the backside of the TAB TAB die, and is used as a thermal heat-sink connection. See the Application Information section for details These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) Storage Temperature Range −65°C to +150°C Lead Temperature Soldering, 5 seconds 260°C ESD Rating Human Body Model(2) ±2 kV Power Dissipation(3) Internally Limited VIN Supply Voltage (Survival) −0.3V to +6.0V VBIAS Supply Voltage (Survival) −0.3V to +6.0V VEN Voltage (Survival) −0.3V to +6.0V VOUT Voltage (Survival) −0.3V to +6.0V IOUT Current (Survival) Internally Limited Junction Temperature −40°C to +150°C (1) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions. (2) The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22- A114. The HBM rating for device pin 1 (EN) is ±1.5 kV. (3) Device power dissipation must be de-rated based on device power dissipation (TD), ambient temperature (TA), and package junction to ambient thermal resistance ( θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not exceed the maximum operating rating. See the Application Information section for details. 2 Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Links: LP38856 |
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