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TPS734XX Datasheet(PDF) 10 Page - Texas Instruments

Part No. TPS734XX
Description  250mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low-Dropout Linear Regulator
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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TPS734XX Datasheet(HTML) 10 Page - Texas Instruments

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Thermal Information
Thermal Protection
Power Dissipation
P
D
+ VIN*VOUT @ IOUT
(2)
Package Mounting
TPS734xx
SBVS089F – DECEMBER 2007 – REVISED FEBRUARY 2009 ........................................................................................................................................ www.ti.com
Thermal protection disables the output when the
The ability to remove heat from the die is different for
junction temperature rises to approximately +165°C,
each
package
type,
presenting
different
allowing the device to cool. When the junction
considerations in the PCB layout. The PCB area
temperature cools to approximately +145°C the
around the device that is free of other components
output circuitry is again enabled. Depending on power
moves the heat from the device to the ambient air.
dissipation,
thermal
resistance,
and
ambient
Performance data for JEDEC low- and high-K boards
temperature, the thermal protection circuit may cycle
are given in the Dissipation Ratings table. Using
on and off. This cycling limits the dissipation of the
heavier
copper
increases
the
effectiveness
in
regulator, protecting it from damage as a result of
removing heat from the device. The addition of plated
overheating.
through-holes
to
heat-dissipating
layers
also
improves the heatsink effectiveness.
Any tendency to activate the thermal protection circuit
indicates
excessive
power
dissipation
or
an
Power dissipation depends on input voltage and load
inadequate heatsink. For reliable operation, junction
conditions. Power dissipation is equal to the product
temperature should be limited to +125°C maximum.
of the output current time the voltage drop across the
To estimate the margin of safety in a complete design
output pass element, as shown in Equation 2:
(including
heatsink),
increase
the
ambient
temperature until the thermal protection is triggered;
use worst-case loads and signal conditions. For good
reliability, thermal protection should trigger at least
+35°C
above
the
maximum
expected
ambient
Solder
pad
footprint
recommendations
for
the
condition
of
your
particular
application.
This
TPS734xx are available from the Texas Instruments
configuration
produces
a
worst-case
junction
web site at www.ti.com.
temperature of +125°C at the highest expected
ambient temperature and worst-case load.
The internal protection circuitry of the TPS734xx has
been designed to protect against overload conditions.
It was not intended to replace proper heatsinking.
Continuously running the TPS734xx into thermal
shutdown degrades device reliability.
10
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Copyright © 2007–2009, Texas Instruments Incorporated


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