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LM2675 Datasheet(PDF) 21 Page - Texas Instruments |
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LM2675 Datasheet(HTML) 21 Page - Texas Instruments |
21 / 30 page LM2675 www.ti.com SNVS129E – MAY 2004 – REVISED JUNE 2005 TYPICAL SURFACE MOUNT PC BOARD LAYOUT, ADJUSTABLE OUTPUT (4X SIZE) CIN - 15 μF, 50V, Solid Tantalum Sprague, “594D series” COUT - 33 μF, 25V, Solid Tantalum Sprague, “594D series” D1 - 1A, 40V Schottky Rectifier, Surface Mount L1 - 68 μH, L30, Coilcraft DO3316 CB - 0.01 μF, 50V, Ceramic R1 - 1k, 1% R2 - Use formula in Design Procedure Figure 14. PC Board Layout Layout is very important in switching regulator designs. Rapidly switching currents associated with wiring inductance can generate voltage transients which can cause problems. For minimal inductance and ground loops, the wires indicated by heavy lines (in Figure 7 and Figure 8) should be wide printed circuit traces and should be kept as short as possible. For best results, external components should be located as close to the switcher IC as possible using ground plane construction or single point grounding. If open core inductors are used, special care must be taken as to the location and positioning of this type of inductor. Allowing the inductor flux to intersect sensitive feedback, IC ground path, and COUT wiring can cause problems. When using the adjustable version, special care must be taken as to the location of the feedback resistors and the associated wiring. Physically locate both resistors near the IC, and route the wiring away from the inductor, especially an open core type of inductor. LLP PACKAGE DEVICES The LM2675 is offered in the 16 lead LLP surface mount package to allow for increased power dissipation compared to the SO-8 and DIP. The Die Attach Pad (DAP) can and should be connected to PCB Ground plane/island. For CAD and assembly guidelines refer to Application Note AN-1187 at http://power.national.com. Copyright © 2004–2005, Texas Instruments Incorporated Submit Documentation Feedback 21 Product Folder Links: LM2675 |
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