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LM3500 Datasheet(PDF) 3 Page - Texas Instruments

Part No. LM3500
Description  Synchronous Step-up DC/DC Converter for White LED Applications
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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LM3500 Datasheet(HTML) 3 Page - Texas Instruments

 
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LM3500
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SNVS231F – MAY 2004 – REVISED APRIL 2007
FB(pin B3): Output voltage feedback connection. Set the primary White LED network current with a resistor from
the FB pin to GND. Keep the current setting resistor close to the device and connected between the FB and
GND pins.
NC(pin A3): No internal connection is made to this pin. The maximum allowable voltage that can be applied to
this pin is 7.5V.
SHDN(pin A2): Shutdown control pin. Disable the device with a voltage less than 0.3V and enable the device
with a voltage greater than 1.1V. The white LED current can be controlled using a PWM signal at this pin. There
is an internal pull down on the SHDN pin, the device is in a normally off state.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
VIN
−0.3V to 7.5V
VOUT (LM3500-16)
(2)
−0.3V to 16V
VOUT (LM3500-21)
(2)
−0.3V to 21V
VSW
(2)
−0.3V to VOUT+0.3V
FB, SHDN, and NC Voltages
−0.3V to 7.5V
Maximum Junction Temperature
150°C
Lead Temperature
(3)
300°C
ESD Ratings (4)
Human Body Model
2kV
Machine Model
200V
(1)
Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the
device is intended to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test
conditions, see the Electrical Characteristics.
(2)
This condition applies if VIN < VOUT. If VIN > VOUT, a voltage greater than VIN + 0.3V should not be applied to the VOUT or VSW pins.
(3)
For more detailed soldering information and specifications, please refer to National Semiconductor Application Note 1112: Micro SMD
Wafer Level Chip Scale Package (AN-1112), available at www.national.com.
(4)
The human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
Operating Conditions
Ambient Temperature
(1)
−40°C to +85°C
Junction Temperature
−40°C to +125°C
Supply Voltage
2.7V to 7V
(1)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (
θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
Thermal Properties
Junction to Ambient Thermal Resistance (
θJA)
(1)
75°C/W
(1)
Junction-to-ambient thermal resistance (
θJA) is highly application and board-layout dependent. The 75ºC/W figure provided was
measured on a 4-layer test board conforming to JEDEC standards. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues when designing the board layout.
Copyright © 2004–2007, Texas Instruments Incorporated
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