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IC149-080-31 Datasheet(PDF) 2 Page - Yamaichi Electronics Co., Ltd. |
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IC149-080-31 Datasheet(HTML) 2 Page - Yamaichi Electronics Co., Ltd. |
2 / 12 page SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW Specifications Insulation Resistance: 500M Ω at 150V DC Withstanding Voltage: 100V eff to 700Veff for 1 minute Contact Resistance: 30m Ω max. at 10mA and 20mV Operating Temp. Range: -25°C to +85°C Reflow-soldering Temp.: 220°C for 60 seconds Mating Cycles: 20 insertions maximum Solvent Durability: Freon Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm - for repetitive screw connection = min 0.078 Nm max 0.098 Nm Materials and Finish Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0 Contact: Beryllium Copper (BeCu) Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5 IC149 - 080 - *30 - B5 Part Number (Details) Series No. No. of Contact Pins Positioning Pins: 0 = Without Pins 1 = With Pins Contact Plating: B5 = Au over Ni ICP-080-6 Compatible Emulation-Adapter IC149 Series (SMT) QFP/TQFP - 80 Pins (20x20) 0.5mm pitch 1. Ensure a clean contact area. Fluxes, dust and other impurifications may cause corrosion and contact problems. 2. This Socket is not for automatic production. It is particulary suitable for the development of software stored in ROM and for testing LSI-IC's. 3. Careful attention must be taken when fixing the Socket, since it is entirely made from thermoplastic material. If the max. torque is exceeded, the Socket will be damaged beyond repair. 4. If using the Socket with an Adapter, please use the gold-plated Socket version. Remarks Notes N1: Metal soldering Tab Clip. Socket may be stabilized by soldering (Reflow) in these 4 areas. N3: These holes are only necessary for use with positioning pins. N3 N1 25.00 Outline Socket Dimensions (Reference Only) IC - Dimensions Socket PCB-Layout Top View from Socket 12mm x 12mm 2.80 max. 12.0 14.0 0.5 0.20 ±0.05 0.5 13 x 13 ±0.2 0.20 ±0.05 Detail for Plastic Package Detail for Ceramic Package See Package Details Detail C Detail C Detail C |
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