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URA_LD-15WR2 & URB_LD-15WR2

2013.11.29-A/3

Page 3of9

Size

PCB mounting（Without heat sink）

50.80×25.40×11.80

mm

PCB mounting（With heat sink）

50.80×25.40×16.30

A2S Chassis mounting（Without heat sink）

76.00×31.50×21.20

A2S Chassis mounting（With heat sink）

76.00×31.50×25.10

A4S DIN-Rail mounting（Without heat sink）

76.00×31.50×25.80

A4S DIN-Rail mounting（With heat sink）

76.00×31.50×29.70

Weight

PCB mounting（Without heat sink）

--

28

--

g

PCB mounting（With heat sink）

--

36

--

A2S Chassis mounting（Without heat sink）

--

50

--

A2S Chassis mounting（With heat sink）

--

58

--

A4S DIN-Rail mounting（Without heat sink）

--

70

--

A4S DIN-Rail mounting（With heat sink）

--

78

--

ENVIRONMENTAL SPECIFICATIONS

Item

Test Conditions

Min.

Typ.

Max.

Unit

Storage Humidity

Non condensing

5

--

95

%

Operating Temperature

See Temperature Derating Curve（Figure3）

-40

--

85

°C

Storage Temperature

-55

--

125

The Max. Case Temperature

Operating Temperature curve range

--

--

105

Lead Temperature

1.5mm from case for 10 seconds

--

--

300

Cooling

Free air convection

Vibrating

10-55Hz, 10G, 30 Min. along X, Y andZ

EMC SPECIFICATIONS

EMI

CE

CISPR22/EN55022

CLASSA（Without External Circuit）/ CLASSB（External Circuit Refer to Figure1-②）

RE

CISPR22/EN55022

CLASSA（Without External Circuit）/ CLASSB（External Circuit Refer to Figure1-②）

EMS

ESD

IEC/EN61000-4-2

Contact

±4KV

perf. CriteriaB

RS

IEC/EN61000-4-3

10V/m

perf. CriteriaA

EFT

IEC/EN61000-4-4

±2KV（External Circuit Refer to Figure1-①）

perf. CriteriaB

Surge

IEC/EN61000-4-5

±2KV（External Circuit Refer to Figure1-①）

perf. CriteriaB

CS

IEC/EN61000-4-6

3 Vr.m.s

perf. CriteriaA

Voltage dips、short

and interruptions

immunity

IEC/EN61000-4-29

0%-70%

perf. CriteriaB

EMC RECOMMENDED CIRCUIT

L D M2

②

C0

TVS

L D M1

MOV

FU SE

①

C1

V in

G ND

+

V in

G ND

+Vo

-Vo

( 0 V)

EUT

L O AD

C Y1

C Y2

(Figure 1)

Note: 1.In Figure 1,part ①is EMS recommended external circuit, part ②is EMI

recommended external circuit. Choose according to requirements.

Recommended external circuit parameters:

Model

Vin:24V

Vin:48V

FUSE

Choose according to practical input current

MOV

S14K35

S14K60

LDM1

56

μH

TVS

SMCJ48A

SMCJ90A

C0

330

μF/50V

330

μF/100V

C1

1

μF /50V

1

μF /100V

LDM2

4.7

μH

CY1、CY2

1nF /2KV

EMC RECOMMENDED CIRCUIT PCB LAYOUT

(Figure 2)

Note: The pad space between input and output (CY1/CY2) must

≥2mm.