3

NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com

www.RFpassives.com

www.SMTmagnetics.com

SPECIFICATIONS ARE SUBJECT TO CHANGE

Low ESR Tantalum Chip Capacitors

NTC-L Series

TAPING SPECIFICATIONS (mm)

RECOMMENDED SOLDERING PROFILES

Note: To avoid thermal shock a preheating stage, 130°C ~ 160°C for 1 minute, should be incorporated into the soldering process

9.0 ± 0.3

2.0 ± 0.5

60.0 ± 0.5

21.0 ± 0.8

13.0 ± 0.5

60

40

20

0

220

210

200

190

260

250

240

230

Temperature (deg. C)

Reflow Soldering - Permitted

Temperature/Time Range

30

40

20

0

220

210

200

260

250

240

230

Temperature (deg. C)

Flow Soldering - Permitted

Temperature/Time Range

10

B Case

C & D

300

200

0

60

30

0

135

125

100

90

Time (Seconds)

Reflow Soldering - Recommended Profile

Maximum Temperature/Time: 260°C/10 Sec.

100

160

150

300

200

0

60

30

0

135

125

100

90

Time (Seconds)

Flow Soldering - Recommended Profile

Maximum Temperature/Time: 245°C/5 Sec.

100

160

150

5 Sec.

150

250

50

Case

Code

A

±0.1

B

±0.1

C

±03

D

±0.1

E

±0.1

F

±0.1

G

±0.1

H

±0.1

J

±0.1

K

max.

t

max.

Reel

Qty

B

3.1

3.8

8.0

3.5

1.75

4.0

2.0

4.0

1.5

2.5

0.2

2000

C

3.7

6.3

12.0

5.5

1.75

8.0

2.0

4.0

1.5

3.0

0.3

500

D

4.8

7.7

12.0

5.5

1.75

8.0

2.0

4.0

1.5

3.4

0.3

500

F

A

D

K

C

B

J

H

T

Cover tape

E

G

Anode