GaN Hybrid Power Amplifier

HT0909-30A

Korean Facilities : 82-31-250-5078 / rfsales@rfhic.com

All specifications may change without notice

US Facility : 919-677-8780 / sales@rfhicusa.com

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Version 1.0

Package Dimensions (Type: NP-1EL)

* Unit: mm[inch] | Tolerance: ±0.15[.006]

Pin Description

Pin No

Function

Pin No

Function

Pin No

Function

Pin No

Function

1

RF Input

4

Vgs1

8

GND

11

GND

2

GND

5

Vds

9

GND

12

GND

3

GND

6

Vgs2

10

RF Output

13

GND

-

-

7

Vds

-

-

14

GND

Recommended Pattern

Recommended Mounting Configuration

* Mounting Configuration Notes

1. For the proper performance of the device, Ground / Thermal via holes must be designed to remove heat.

2. To properly use heatsink, ensure the ground/thermal via hole region to contact the heatsink. We recommend the mounting screws

be added near the heatsink to mount the board

3. In designing the necessary RF trace, width will depend upon the PCB material and construction.

4. Use 1 oz. Copper minimum thickness for the heatsink.

5. Do not put solder mask on the backside of the PCB in the region where the board contacts the heatsink

6. We recommend adding as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.

Detail Pattern ‘A’