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1 / 12 page ![]() Appendix - 131 - www.nve.com phone: 952-829-9217 fax: 952-829-9189 Appendix Package Drawings and Specifications Package Drawing – SOIC8 Dimensions: inch (mm) .154 (3.91) .020 (.508) .188 (4.77) .054 (1.37) .061 (1.55) .154 (3.91) .236 (5.99) .017 TYP. .193 (4.90) NVE XXXXX -XX .050 (1.27) x 6 BASIC .004 (.10) MIN. .010 (.26) MAX. .016 (.40) NOM. .015 (.381) x45° Note: SOIC8 Package has thermal power dissipation of 240°C/Watt in free air. Attaching the package to a circuit board improves thermal performance. Package Drawing – MSOP8 Dimensions: inches (mm) .118 (3.00) .021 (.533) .154 (3.91) .034 (.86) .040 (1.02) .004 (.10) MIN. .012 (.31) MAX. .0256 (.65) x 6 BASIC NVE XXX .118 (3.00) .193 (4.90) .012 TYP. .118 (3.00) .005 (.13) NOM. Note: MSOP8 Package has thermal power dissipation of 320°C/Watt in free air. Attaching the package to a circuit board improves thermal performance. |
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