THS3120

THS3121

RECOMMENDED OPERATING CONDITIONS

PARAMETER

MIN

NOM

MAX

UNIT

Dual supply

±5

±15

Supply voltage

V

Single supply

10

30

Commercial

0

+70

°C

Industrial

–40

+85

–40

+125

°C

–40

+85

°C

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature, unless otherwise noted.

PARAMETER

UNIT

33 V

±4 V

(2)

550 mA

Continuous power dissipation

See Dissipation Ratings Table

(3)

+150°C

(4)

+125°C

Commercial

0°C to +70°C

Industrial

–40°C to +85°C

–65°C to +125°C

HBM

1000

ESD ratings:

CDM

1500

MM

200

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The THS3120 and THS3121 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected

to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature

which could permanently damage the device. See TI Technical Brief SLMA002 for more information about using the PowerPAD

thermally-enhanced package.

(3)

The absolute maximum temperature under any condition is limited by the constraints of the silicon process.

(4)

The maximum junction temperature for continuous operation is limited by the package constraints. Operation above this temperature

may result in reduced reliability and/or lifetime of the device.

Copyright © 2003–2009, Texas Instruments Incorporated

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Product Folder Link(s): THS3120 THS3121