5

NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com

www.RFpassives.com

www.SMTmagnetics.com

SPECIFICATIONS ARE SUBJECT TO CHANGE

CONSTRUCTION

Item

Material

1

Insulation Coating

Epoxy

2

Marking

Epoxy

3

Cutting Line

-

4

Ceramic Core

Ceramic

5

Resistive Film

Metal Film

6

Terminal

Fe/Cu/Ni/Sn

1

2

3 4

5 6

Type

Case Size

A

B

C

NFR0102

0102

1.5

0.8

1.0

NFR0204

0204

1.6

1.2

1.6

NFR0207

0207

2.4

1.7

3.0

LAND PATTERN DIMENSIONS (mm)

REFLOW SOLDERING TEMPERATURE PROFILE

200°C

300°C

260°C

50°C

180°C

100°C

0

120 sec. max.

3 sec. max.

Peak Temperature 260°C

220°C

Time above 220°C

60 sec. max.

NFR Series

Metal Film MELF Resistors

B

A

C

Land Pads