Data Sheet

8

Rev. 1.0, 2011-02-07

IFX80471

General Product Characteristics

Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the

data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are

not designed for continuous repetitive operation.

Buck output voltage input VOUT

4.1.21

Voltage

V

VOUT

– 0.3

15

V

IFX80471SKV

4.1.22

Voltage

V

VOUT

– 0.3

6.8

V

IFX80471SKV50

4.1.23

Current

I

VOUT

–

–

V

–

Compensation input COMP

4.1.24

Voltage

V

COMP

– 0.3

6.8

V

–

4.1.25

Current

I

COMP

–

–

V

–

Reset output RO

4.1.26

Voltage

V

RO

– 0.3

6.8

V

–

4.1.27

Current

I

RO

–

–

V

limited internally

Frequency synchronization input SYNC

4.1.28

Voltage

V

SYNC

– 0.3

6.8

V

–

4.1.29

Current

I

SYNC

–

–

V

–

Temperatures

4.1.30

Junction Temperature

T

J

-40

150

°C

–

4.1.31

Storage temperature

T

STG

-50

150

°C

–

ESD Susceptibility

4.1.32

ESD Resistivity Pin

V

OUT

V

ESD_VOUT

-1.5

1.5

kV

4.1.33

ESD Resistivity all Pins except

V

OUT

V

ESD

-2

2

kV

HBM2)

4.1.34

ESD Resistivity to GND

V

ESD

-500

500

V

1) Not subject to production test, specified by design.

2) ESD susceptibility, HBM according to EIA/JESD 22-A114B

3) ESD susceptibility, Charged Device Model “CDM” EIA/JESD22-C101 or ESDA STM5.3.1

all voltages with respect to ground, positive current flowing into pin (unless otherwise specified)

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Max.