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NTD24N06G Datasheet(PDF) 1 Page - ON Semiconductor

Part # NTD24N06G
Description  Power MOSFET 60 Volt, 24 Amp
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NTD24N06G Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 4
1
Publication Order Number:
NTD24N06/D
NTD24N06
Power MOSFET
60 Volt, 24 Amp
N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
Pb−Free Packages are Available
Typical Applications
Power Supplies
Converters
Power Motor Controls
Bridge Circuits
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
60
Vdc
Drain−to−Gate Voltage (RGS = 10 MW)
VDGR
60
Vdc
Gate−to−Source Voltage
− Continuous
− Non−repetitive (tpv10 ms)
VGS
VGS
"20
"30
Vdc
Drain Current
− Continuous @ TA = 25°C, TJ = 150°C
− Continuous @ TA = 25°C, TJ = 175°C
− Continuous @ TA = 100°C, TJ = 175°C
− Single Pulse (tpv10 ms), TJ = 175°C
ID
ID
ID
IDM
24
27
19
80
Adc
Adc
Adc
Apk
Total Power Dissipation @ TA = 25°C
Derate above 25
°C
Total Power Dissipation @ TA = 25°C (Note 1)
Total Power Dissipation @ TA = 25°C (Note 2)
PD
62.5
0.42
1.88
1.36
W
W/
°C
W
W
Operating and Storage Temperature Range
TJ, Tstg
−55 to
+175
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 50 Vdc, VGS = 10 Vdc,
L = 1.0 mH, IL(pk) = 18 A, VDS = 60 Vdc)
EAS
162
mJ
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
RqJC
RqJA
RqJA
2.4
80
110
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8 in from case for 10 seconds
TL
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR−4 board using the 0.5 sq in drain pad size.
2. When surface mounted to an FR−4 board using the minimum recommended
pad size.
N−Channel
D
S
G
http://onsemi.com
60 V
32 m
W
RDS(on) TYP
24 A
ID MAX
V(BR)DSS
1
Gate
3
Source
2
Drain
4
Drain
DPAK
CASE 369C
(Surface Mount)
STYLE 2
MARKING DIAGRAMS
& PIN ASSIGNMENTS
1 2
3
4
1
Gate
3
Source
2
Drain
4
Drain
DPAK
CASE 369D
(Straight Lead)
STYLE 2
1
2
3
4
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
Y
= Year
WW
= Work Week
24N06
= Device Code
G
= Pb−Free Package


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