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RK102P Datasheet(PDF) 4 Page - Samsung semiconductor

Part # RK102P
Description  Passive components sales offices
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

RK102P Datasheet(HTML) 4 Page - Samsung semiconductor

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Recommended Soldering
Conditions
6
7
Since Chip resistors come into direct contact with melted solder during soldering, it is exposed to potential mechanical stress caused
by the sudden temperature change. The chip resistors may also be subject to silver migration and flux contamination.
•There are 3 soldering methods.
- Flow(wave) soldering.
- Reflow soldering. (Reflow soldering is broadly divided into the total heating method and local heating method.)
- Iron soldering.
•Features
PCB
solder
Primary wave
Secondary wave
There are two types of soldering methods in flow(wave) soldering.
One is single wave soldering, and the other is a double waves
soldering. However, double waves soldering is mainly used. This
method is designed for continuous and multiple dipping process by
using primary and secondary wave, having completely different
waveforms and characteristics.
With the primary wave, a comparatively strong jet flow is used
to remove the flux gas and to solder.
With the secondary wave, it is used to remove excessive solder.
With the primary wave, the solder flows into a very small gap
between components and air bubbles remaining on the soldered
joint are removed.
With the secondary wave, the peel back is used to prevent bridging.
•Preheating
If a chip component is heated suddenlyduring soldering, it may
crack by the thermal shock caused by the temperature difference
between the surface and the inside of the chip. To prevent this,
a full preheating is necessary. In case of wave soldering, the
temperature difference between solder and surface of the
component should be kept within 150℃. Also when cooling is
done by dipping into solvent, care should be taken to keep the
temperature difference within 150℃.
•Standard Soldering Condition
Soldering must be carried out without exceeding the approved
soldering temperature and time shown within the shaded area
of the graph at right. An excessively long soldering time or high
soldering temperature results in leaching of outer terminations.
When a PCB is warped, mechanical stress applied to the chip
will be increased and might cause chip crack, especially if there
is a big amount of solder on the chip. So, care should be taken
not to use excessive amount of solder on the PCB.
For the flow(wave) soldering, the solder amount can be
controlled by land size.
Soldering Methods
Reflow Soldering
Total Heating
Local Heating
Laser
Wave Soldering
Single Wave
Double Waves
Infrared Ray
Iron Soldering
Convection/Infrared
Hot Air
Hot Plate
Optical Beam
Air Heater
•Pre-heating and cooling
In the reflow soldering method, a full pre-heating at the proper
temperature is necessary to dry and activate solder paste.
Tomb-stoning can be reduced by preheating at 150~180℃ for
more than 1 minute. Also when cooling is done by dipping into
solvent, care should be taken to keep the temperature difference
within 150℃.
•Standard Reflow Soldering Condition
Soldering must be carried out without exceeding the approved
soldering temperature and time shown within the shaded area
of the right graph. This prevents the terminations from leaching
and characteristics from deteriorating. When soldering is
repeated, the allowed time is the accumulated time.
•Standard solder amount
When a PCB is warped, mechanical stress applied to the chip should be reduced, and to do so, care should be taken not to use
excessive amount of solder on the PCB. In the case of the reflow method, the thickness of the coated solder paste is controlled to
prevent excessive solder. The thickness of solder paste should be 100~300㎛.
When using a soldering iron or any other soldering operation, the permissible temperature and time should not exceed
that of the reflow soldering. In order to prevent the external terminations from leaching and characteristics from deteriorating,
the tip of the soldering iron should not touch the chip component (ceramic element, resin case, etc.). Soldering with a soldering
iron and correcting with a soldering iron can be performed right under following conditions.
Temperature at tip
Soldering iron output
End of soldering iron
Note
350
℃ Max.
20-Watt Max.
Ø3mm Max.
Do not directly touch the chip by the tip of the iron.
Item
Condition
Ceramic Substrate
Inner Electrode
Resistor
Glass Coat
Protective Coat
Terminal Coat
Ni Plate
Sn Plate
Al2O3
Ag
RuO2
Bi2O3, SiO2
Polymer / Glass
Ni-Cr Alloy /Ag
Ni
Sn
Name
No.
Main Substance
< Reflow Soldering>
< Flow Soldering>
•Tombstoning and Prevention
When reflow soldering, or especially vapor phase soldering (VPS), small chip components of less than RC3216 type may break
away from solder and stand on end. This is commonly known as tombstoning or the Manhattan phenomenon.
- Preventing tombstoning
Keep land size as small as possible.
Keep the pre-heating conditions properly
( Pre-heating temperature : 150 ~ 180°, Pre-heating time : more than 1 min.)
Keep the solder paste quantity not too much and uniform for every lands.
Keep the position of chips properly.
At around the soldering temperature, keep minimum difference of the temperature between the electrodes of a chip.
Abstract
Reflow Soldering
Iron Soldering
General Structure of the Chip Resistor
Flow(wave) Soldering
Pre-heating
120 sec. min.
Time(sec.)
Soldering
Temp.(
℃)
Pre-heating
Temp.(
℃)
Gradual Cooling
in the air
260
±5℃
5 sec. max.
(Ⅰ)1206(3216) and below
:150
℃ max.
△T
Pre-heating
217
Soldering
Temp.(
℃)
200
150
Gradual Cooling
in the air
260
±5℃
10 sec. max.
Time(sec.)
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
General Structure
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
General
Precision
Jumper
Low ohms
(RUT Series)
Ultra Low ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RJ Series)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Anti-Sulfur
Resistors
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value


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