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RM102P Datasheet(PDF) 3 Page - Samsung semiconductor |
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RM102P Datasheet(HTML) 3 Page - Samsung semiconductor |
3 / 20 page Operation Notes Example of Land Pattern Design 4 5 To maintain proper quality of chip components, the following precautions are required for storage environment, method and period. •Storage Environment - Make sure that the ambient temperature is within 5℃~40℃ and the ambient humidity is within 20~70%RH. - Chip components may be deformed, if the temperature of packaged components exceeds 40℃. - Do not store where the soldering properties can be deteriorated by harmful gas such as sulphurous gas, chlorine gas, etc. - Bulk packed chip components should be used as soon as the seal is opened, thus preventing the solderability from deteriorating. - The remaining unused chips should be put in the original bag and sealed again or store in a desiccator containing a desiccating agent. •Storage Time Period Stored chip components should be used within 6 months after receiving the components. If 6 months or more have elapsed, please check the solderability before actually using. •Chip resistors are designed for general electronic devices such as home appliances, computer, mobile communications, digital circuit, etc. If you require our products with high reliability-performing at more than 125℃ or below -55℃- for medical equipments, aircrafts, high speed machines, military usage, and items that can affect human life or if you need to use in specific conditions (corrosive gas atmosphere like H2S etc.), please contact us beforehand. •Normal operation temperature ranges (℃): -55℃~+155℃ •Others (rectangular, array_Flat type, trimmable) : -55℃~+125℃ •Although resistor body is coated, sharp excessive impact should be avoided to prevent damages and adverse effects on characteristics (resistor value, open circuited, T.C.R.). When designing P.C.B, the shape and size of the solder lands must allow a proper amount of solder to form under the resistor. The amount of solder formed at the end terminations has direct effect on the possibility of chip crack. The more the amount of solder and stress, the more the possibilities of chip crack. Type A B 2A+B C 1005 1608 2012 3216 3225 5025 6432 0.7 0.9 1.0 1.4 1.4 1.5 1.5 0.5 0.8 1.4 1.8 1.8 3.3 4.6 1.9 2.6 3.4 4.6 4.6 6.3 7.6 0.5 0.8 1.3 1.6 2.6 2.5 3.2 (UNIT: mm) Type A B 2A+B C 0402 0603 1005 1608 2012 3216 3225 5025 6432 0.17 0.37 0.6 0.8 0.9 1.3 1.3 1.4 1.4 0.20 0.28 0.5 0.8 1.4 1.8 1.8 3.3 4.6 0.54 1.02 1.7 2.4 3.2 4.4 4.4 6.1 7.4 0.18 0.29 0.5 0.8 1.2 1.5 2.4 2.4 3.0 (UNIT: mm) Type A B C D E P1 P2 062P 064P 10AT 102P 104P 164P 0.20 0.20 0.4 0.4 0.7 0.7 0.20 0.20 0.4 0.4 0.3 0.5 0.30 0.20 0.25 0.25 0.2 0.3 0.30 0.30 0.5 0.5 0.5 0.9 0.30 0.30 0.5 0.5 0.5 0.8 0.6 0.5 0.65 0.65 0.55 0.9 - 0.5 - 0.5 0.8 (UNIT: mm) A B A C : Land Pattern : Chip Resistor : Land Pattern : Chip Resistor A P2 P1 P B C D E •Convex type •Flow soldering •Reflow soldering Type A B 2A+B C 1005 1608 2012 3216 3225 5025 6432 0.8 0.8 0.9 1.7 1.7 2.15 2.3 0.5 0.5 0.8 1.2 1.2 1.8 3.0 2.1 2.1 2.6 4.6 4.6 6.1 7.6 0.5 0.8 1.2 1.4 2.6 2.6 3.3 (UNIT: mm) •Reflow soldering(RU,RUW,RUK) •This is the recommended land pattern for designing PCB. This pattern does not guarantee any characteristic of other product. AB C D E •Concave type Applications Please give more attention not to press the chip owing to the nozzle's improper height when it is mounted on PCB. (Excessive pressure may cause exterior damage, change in resistance, circuit open, etc.) Mounting Storage •These products are designed and produced for applying to the ordinary electronic equipments. (AV equipment, OA equipment,Telecommunication equipment, etc) •Consult with our sales department before applying in the devices that require extremely high reliability such as medical equipments, transport equipments, aircrafts/spacecrafts, nuclear power controllers, fuel controllers, car equipments including car accessories and other safety devices. •Following special environments, and such environmental conditions may affect the performance of the product. Please verify the performance and reliability thoroughly prior to use. a) Using in various type of Liquid including water, oil, organic solvent and other chemicals. b) Using in the places where the products are exposed to direct sunlight, sea wind, corrosive gases (including Cl2, H2S, NH3, SO2, NO2), static electricity, electromagnetic waves and dusty air. c) Using close to heat generating components or other flammable items. d) Using in the places that is sealed or coated with resins or other coating materials after soldering. e) Using in places subject to dew condensation. •These products are not radiation resistant. •The company is not responsible for any problems resulting from using of the products under the conditions not recommended herein. •The company should notify any safety issues of the products to the customer. And the safety of the products should be monitored by the customer periodically. Safety precautions Example of Land Pattern Design For Chip Type For Array Type After Soldering Cleaning, soldering flux & Ionic cleaning liquid should be avoided on product. If any possibility on product, please take a test before usage. Cleaning •Manual work Whenever separating chip resistor from PCB, do not re-use the chip resistor for circuit safety. Electrical specification of chip resistors can be changed by soldering iron after separation. Re-use of separated chip resistor should be prohibited. •Do not use more than rated voltage. (Please check the contents of each product) Others Chip resistor installation on PCB is a similar phenomenon on to a chocolate chip on top of a cake. PCB has enough flexibility on outer force but Chip resistor can be defected without any bending. (By chip resistor use of Ceramic, solder, metal) Therefore, when separating a Chip resistor from a PCB, beware of any crack on the chip. Caution for Chip Resistor Seperation from PCB. Type A B C D E P 102P 104P 0.3 0.3 0.3 0.3 0.2 0.2 0.5 0.5 0.4 0.4 0.5 0.5 (UNIT: mm) The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. Operation Notes Example of land Pattern Design Recommended Soldering Conditions General Structure General Precision Jumper Low ohms (RUT Series) Ultra Low ohms (RU Series) Ultra Low Ohms (RUK Series) Ultra Low Ohms (RJ Series) Arrays (CONVEX Type) Arrays (CONCAVE Type) Arrays (FLAT Type) Anti-Sulfur Resistors Attenuator Characteristics Performance Packaging Standard Resistance Value |
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