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RM102P Datasheet(PDF) 12 Page - Samsung semiconductor |
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RM102P Datasheet(HTML) 12 Page - Samsung semiconductor |
12 / 20 page 22 23 Arrays(Convex Type) RP102P RP104P RP164P Type 1.00±0.10 2.00±0.10 3.20±0.10 1.00±0.10 1.00±0.10 1.60±0.10 0.35±0.10 0.35±0.10 0.50±0.10 0.33±0.10 0.30±0.15 0.40±0.15 - 0.40±0.15 0.60±0.15 0.20±0.10 0.15±0.10 0.30±0.15 0.25±0.10 0.25±0.15 0.30±0.15 0.65±0.10 0.50±0.15 0.80±0.15 1.1 ㎎ 2.2 ㎎ 8.9 ㎎ L W HA1 A2 I1 I2 P Average Weight (UNIT: mm) •2 Array •4 Array A1 W L L A1 W p RP: Convex type array RP Code Designation 10 : 1005 16 : 1608 10 Dimension 2P: 2 Pieces 4P: 4 Pieces 4P Resistors J: ±5% J Tolerance 3 digit coding system (IEC coding system) E-24 series 1 0 0 Resistance Value CS : Tape Packaging 7" ES : Tape Packaging 10" AS : Tape Packaging 13" CS Packaging Code •The part number system shall be in the following format 1 Ω~9.9Ω:±300 10 Ω~1 :±200 1 Ω~1MΩ -55 ℃~+155℃ 70 ℃ 102P 104P 164P Type 1/16 Power Rating (W) 25(V) 25(V) 50(V) 50(V) 50(V) 100(V) Working Voltage (MAX) Overload Voltage (MAX) TCR (ppm/℃) Resistance Range (Ω) Rated Ambient Temperature Rated Working Temperature • Rated voltage (V) = Rated voltage should be lower than (MAX) working voltage. √Rated power(W)×Nominal resistance value (Ω) The rated power is the maximum continuous loading power at 70℃ ambient temperature. For ambient temperature above 70℃, the loading power follows the below power derating curve. 100 80 60 40 20 0 Operation area -55 -30 0 30 60 90 120 150 Ambient Temperature( ℃) 70 155 •3 digits indication(E-24 series) - Left 2 digits represent significant figures. - Last 1 digit represents exponential number of 10. - Example: 103 Left 2 digits: 10 Last 1 digit: 3 103 = 10 ×103 =10000Ω=10kΩ •RP102P : No marking. 1 10 03 3 •Reducing SMD surface area (40% reduced). •Reducing SMD costs (75% reduced). •Both flow and reflow soldering are applicable. The product of lead-free terminal is RoHS compliant. PhO(lead oxide) is included in the glass of our product which is prescribed on RoHS appendix as an exception. •For semiconductor devices. •For computers, digital circuits. Feature Application Structure and Dimensions Parts Numbering System Specification Power Derating Curve Marking The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. Land Pattern Type A B C D E P1 P2 10AT 102P 104P 164P 0.4 0.4 0.7 0.7 0.4 0.4 0.3 0.5 0.25 0.25 0.2 0.3 0.5 0.5 0.5 0.9 0.5 0.5 0.5 0.8 0.65 0.65 0.55 0.9 - 0.5 0.8 1 15 50 0 P A BC E D : Land Pattern : Chip Resistor A2 H I2 I1 H I2 I1 p Operation Notes Example of land Pattern Design Recommended Soldering Conditions General Structure General Precision Jumper Low ohms (RUT Series) Ultra Low ohms (RU Series) Ultra Low Ohms (RUK Series) Ultra Low Ohms (RJ Series) Arrays (CONVEX Type) Arrays (CONCAVE Type) Arrays (FLAT Type) Anti-Sulfur Resistors Attenuator Characteristics Performance Packaging Standard Resistance Value |
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