Operation Notes

Example of Land

Pattern Design

4

5

To maintain proper quality of chip components, the following

precautions are required for storage environment, method and

period.

•Storage Environment

- Make sure that the ambient temperature is within 5℃~40℃

and the ambient humidity is within 20~70%RH.

- Chip components may be deformed, if the temperature of

packaged components exceeds 40℃.

- Do not store where the soldering properties can be

deteriorated by harmful gas such as sulphurous gas,

chlorine gas, etc.

- Bulk packed chip components should be used as soon as

the seal is opened, thus preventing the solderability from

deteriorating.

- The remaining unused chips should be put in the original

bag and sealed again or store in a desiccator containing a

desiccating agent.

•Storage Time Period

Stored chip components should be used within 6 months

after receiving the components. If 6 months or more have

elapsed, please check the solderability before actually using.

•Chip resistors are designed for general electronic devices

such as home appliances, computer, mobile communications,

digital circuit, etc. If you require our products with high

reliability-performing at more than 125℃ or below -55℃- for

medical equipments, aircrafts, high speed machines, military

usage, and items that can affect human life or if you need to

etc.), please contact us beforehand.

•Normal operation temperature ranges (℃): -55℃~+155℃

•Others (rectangular, array_Flat type, trimmable) : -55℃~+125℃

•Although resistor body is coated, sharp excessive impact

should be avoided to prevent damages and adverse effects

on characteristics (resistor value, open circuited, T.C.R.).

When designing P.C.B, the shape and size of the solder lands must allow a proper amount of solder to form under the resistor.

The amount of solder formed at the end terminations has direct effect on the possibility of chip crack.

The more the amount of solder and stress, the more the possibilities of chip crack.

Type

A

B

2A+B

C

1005

1608

2012

3216

3225

5025

6432

0.7

0.9

1.0

1.4

1.4

1.5

1.5

0.5

0.8

1.4

1.8

1.8

3.3

4.6

1.9

2.6

3.4

4.6

4.6

6.3

7.6

0.5

0.8

1.3

1.6

2.6

2.5

3.2

(UNIT: mm)

Type

A

B

2A+B

C

0402

0603

1005

1608

2012

3216

3225

5025

6432

0.17

0.37

0.6

0.8

0.9

1.3

1.3

1.4

1.4

0.20

0.28

0.5

0.8

1.4

1.8

1.8

3.3

4.6

0.54

1.02

1.7

2.4

3.2

4.4

4.4

6.1

7.4

0.18

0.29

0.5

0.8

1.2

1.5

2.4

2.4

3.0

(UNIT: mm)

Type

A

B

C

D

E

062P

064P

10AT

102P

104P

164P

0.20

0.20

0.4

0.4

0.7

0.7

0.20

0.20

0.4

0.4

0.3

0.5

0.30

0.20

0.25

0.25

0.2

0.3

0.30

0.30

0.5

0.5

0.5

0.9

0.30

0.30

0.5

0.5

0.5

0.8

0.6

0.5

0.65

0.65

0.55

0.9

-

0.5

-

0.5

0.8

(UNIT: mm)

A

B

A

C

: Land Pattern

: Chip Resistor

: Land Pattern

: Chip Resistor

A

P

B

C

D

E

•Convex type

•Flow soldering

•Reflow soldering

Type

A

B

2A+B

C

1005

1608

2012

3216

3225

5025

6432

0.8

0.8

0.9

1.7

1.7

2.15

2.3

0.5

0.5

0.8

1.2

1.2

1.8

3.0

2.1

2.1

2.6

4.6

4.6

6.1

7.6

0.5

0.8

1.2

1.4

2.6

2.6

3.3

(UNIT: mm)

•This is the recommended land pattern for designing PCB.

This pattern does not guarantee any characteristic of other product.

AB

C

D

E

•Concave type

Applications

Please give more attention not to press the chip owing to the

nozzle's improper height when it is mounted on PCB.

(Excessive pressure may cause exterior damage, change in

resistance, circuit open, etc.)

Mounting

Storage

•These products are designed and produced for applying

to the ordinary electronic equipments.

(AV equipment, OA equipment,Telecommunication

equipment, etc)

•Consult with our sales department before applying

in the devices that require extremely high

reliability such as medical equipments, transport

equipments, aircrafts/spacecrafts, nuclear power

controllers, fuel controllers, car equipments including

car accessories and other safety devices.

•Following special environments, and such

environmental conditions may affect the performance

of the product. Please verify the performance

and reliability thoroughly prior to use.

a) Using in various type of Liquid including water,

oil, organic solvent and other chemicals.

b) Using in the places where the products are exposed

to direct sunlight, sea wind, corrosive

static electricity, electromagnetic waves and dusty air.

c) Using close to heat generating components or

other flammable items.

d) Using in the places that is sealed or coated

with resins or other coating materials after

soldering.

e) Using in places subject to dew condensation.

•These products are not radiation resistant.

•The company is not responsible for any problems

resulting from using of the products under the

conditions not recommended herein.

•The company should notify any safety issues of the

products to the customer. And the safety of the

products should be monitored by the customer

periodically.

Safety precautions

Example of Land Pattern Design

For Chip Type

For Array Type

After Soldering Cleaning, soldering flux & Ionic cleaning

liquid should be avoided on product.

If any possibility on product, please take a test before usage.

Cleaning

•Manual work

Whenever separating chip resistor from PCB, do not re-use

the chip resistor for circuit safety.

Electrical specification of chip resistors can be changed

by soldering iron after separation.

Re-use of separated chip resistor should be prohibited.

•Do not use more than rated voltage.

(Please check the contents of each product)

Others

Chip resistor installation on PCB is a similar phenomenon on

to a chocolate chip on top of a cake.

PCB has enough flexibility on outer force but Chip resistor

can be defected without any bending.

(By chip resistor use of Ceramic, solder, metal)

Therefore, when separating a Chip resistor from a PCB,

beware of any crack on the chip.

Caution for Chip Resistor

Seperation from PCB.

Type

A

B

C

D

E

P

102P

104P

0.3

0.3

0.3

0.3

0.2

0.2

0.5

0.5

0.4

0.4

0.5

0.5

(UNIT: mm)

The specifications and designs contained herein may be subject to change without notice.

Please contact our sales representatives or product engineers before order.

Operation

Notes

Example of land

Pattern Design

Recommended

Soldering Conditions

General Structure

General

Precision

Jumper

Low ohms

(RUT Series)

Ultra Low ohms

(RU Series)

Ultra Low Ohms

(RUK Series)

Ultra Low Ohms

(RJ Series)

Arrays

(CONVEX Type)

Arrays

(CONCAVE Type)

Arrays

(FLAT Type)

Anti-Sulfur

Resistors

Attenuator

Characteristics

Performance

Packaging

Standard

Resistance Value