FM320 THRU FM3100

Features

Plastic package has Underwriters Laboratory

Flammability Classification 94V-O Utilizing Flame

Retardant EpoxyMolding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

Mechanical data

Case : Molded plastic, JEDEC DO-214AB

Terminals : Solder plated, s olderable per MIL-STD-750,

Method 2026

Polarity : Indicated by cathode band

Mounting Position : Any

Weight : 0.00585 ounce, 0.195 gr am

(V)

(V)

(V)

(V)

FM320

SS32

20

14

20

FM330

SS33

30

21

30

FM340

SS34

40

28

40

FM350

SS35

50

35

50

FM360

SS36

60

42

60

FM380

SS38

80

56

80

FM3100

S310

100

70

100

0.50

0.75

0.85

-55 to +125

-55 to +150

SYMBOLS

MARKING

CODE

Operating

temperature

V

RRM

*1

V

RMS

*2

V

R

*3

V

F

*4

PARAMETER

CONDITIONS

Symbol

MIN.

TYP.

MAX.

UNIT

Forward rectified current

See Fig.1

3.0

A

Forward surge current

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

80

A

25

0.5

mA

20

mA

Thermal resistance

Junction to ambient

R

55

Diode junction capacitance

f=1MHz and applied 4vDC reverse voltage

250

pF

Storage temperature

-55

+150

Reverse current

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage

Chip Schottky Barrier Diodes

Silicon epitaxial planer type

Formosa MS

0.276(7.0)

0.260(6.6)

0.012(0.3) Typ.

0.189(4.8)

0.173(4.4)

0.244(6.2)

0.228(5.8)

0.087(2.2)

0.071(1.8)

0.040 (1.0) Typ.

0.040(1.0) Typ.

Dimensions in inches and (millimeters)

SMC

0.152(3.8)

0.144(3.6)

0.032(0.8) Typ.