LMA419

Phone:

(408) 988-1845

http://

www.filss.com

Revised:

12/05/00

Fax:

(408) 970-9950

Email:

sales@filss.com

• ASSEMBLY DRAWING

Notes:

•

Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The

bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is

recommended. Ultrasonic bonding is not recommended.

•

The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes.

•

Bond on bond or stitch bond acceptable.

•

Conductor over conductor acceptable. Conductors must not short.