List of Figures

1-1

RFID System With Reader, Antenna and Tag-it HF-I Transponder

................................................... 8

1-2

Memory Organization of the Tag-it HF-I Plus Transponder IC

....................................................... 10

2-1

Wafer on FFC

............................................................................................................... 15

2-2

Antenna and Test Pad Location

.......................................................................................... 17

2-3

Cross Section of Bump

.................................................................................................... 18

3-1

Position of Wafer Identification Code

.................................................................................... 20

3-2

Wafer Identification Code 1

............................................................................................... 21

3-3

Wafer Identification Code 2

............................................................................................... 21

3-4

Ink Dot Drawing

............................................................................................................ 22

3-5

Packing of Wafers

.......................................................................................................... 23

3-6

Packing of Sawn Wafers (Multi)

.......................................................................................... 24

3-7

Packing of Sawn Wafers (Single)

........................................................................................ 25

3-8

Barcode Label

.............................................................................................................. 25

List of Tables

1-1

Command Set for Tag-it HF-I Plus Transponder IC

................................................................... 10

1-2

Part Numbers

............................................................................................................... 11

2-1

Absolute Maximum Ratings

............................................................................................... 14

2-2

Recommended Operating Conditions

................................................................................... 14

2-3

Electrical Characteristics

................................................................................................. 14

2-4

General Mechanical Wafer Specification

................................................................................ 14

2-5

Mechanical Wafer Specification After Grinding, Sawing on FFC

.................................................... 15

2-6

Mechanical Die Specification

............................................................................................. 16

2-7

Antenna and Test Pad Location

.......................................................................................... 16

2-8

Bump Specification

......................................................................................................... 17

3-1

Ink Dot Specification

....................................................................................................... 22

3-2

Ink Dot Placement

.......................................................................................................... 23

3-3

Storage Conditions

......................................................................................................... 26

4

List of Figures

SCBU046 (11-09-21-063) – October 2007

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