Contents

Preface

............................................................................................................................... 5

1

Introduction

............................................................................................................... 7

1.1

General

............................................................................................................... 8

1.2

System Description

................................................................................................. 8

1.3

Product Description

................................................................................................. 8

1.4

Functional Description

.............................................................................................. 9

1.5

Memory Organization

.............................................................................................. 9

1.6

Command Set

..................................................................................................... 10

1.7

Ordering Information and Part Numbers

....................................................................... 11

2

Specification

............................................................................................................ 13

2.1

Electrical Specification

........................................................................................... 14

2.2

Mechanical Wafer Specification

................................................................................. 14

2.3

Mechanical Die Specification

.................................................................................... 16

2.4

Bump Specification

................................................................................................ 17

3

Shipping, Packing & Further Handling

........................................................................ 19

3.1

Lot Definition

....................................................................................................... 20

3.2

Wafer identification

................................................................................................ 20

3.3

Wafer Map File

.................................................................................................... 21

3.4

Ink Dot Specification

.............................................................................................. 22

3.5

Packing for Wafers

................................................................................................ 23

3.6

Packing for Sawn Wafers

........................................................................................ 24

3.7

Barcode Label

..................................................................................................... 25

3.8

Storage Conditions

............................................................................................... 26

4

Regulatory, Safety, and Warranty Notices

................................................................... 27

4.1

Regulatory, Safety, and Warranty Notices

..................................................................... 28

4.2

Warranty and Liability

............................................................................................. 28

4.3

Hazards from Electrostatic Discharge ESD

.................................................................... 28

A

Terms & Abbreviations

.............................................................................................. 29

SCBU046 (11-09-21-063) – October 2007

Contents

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