Chip Resistor Surface Mount

www.yageo.com

Oct 20, 2009 V.4

Product specification

4

9

SERIES

RC

2512 (RoHS Compliant)

CONSTRUCTION

The resistor is constructed on top

of a high-grade ceramic body.

Internal metal electrodes are added

on each end to make the contacts to

the thick film resistive element. The

composition of the resistive element

is a noble metal imbedded into a

glass and covered by a second glass

to prevent environment influences.

The resistor is laser trimmed to the

rated resistance value. The resistor

is covered with a protective epoxy

coat, finally the two external

terminations (matte tin on Ni-

barrier) are added. See fig.3

DIMENSIONS

TYPE

RC2512

L (mm)

6.35 ± 0.10

W (mm)

3.10 ± 0.15

H (mm)

0.55 ± 0.10

0.60 ± 0.20

0.50 ± 0.20

Table 1

overcoat

Primary glass layer

resistive layer

(Jumper chip is a conductor)

inner electrode

termination (Ni/matte tin)

ceramic substrate

H

I2

YNSC066

overcoat

W

L

marking layer

O

S

For dimension see Table 1

Fig. 3 Chip resistor outlines

MARKING

RC2512

E-24 series: 3 digits

First two digits for significant figure and 3rd digit for number of zeros

Both E-24 and E-96 series: 4 digits

First three digits for significant figure and 4th digit for number of zeros

For further marking information, please see special data sheet “Chip resistors marking”.

Fig. 1

Value=10 KΩ

YNSC001

03

Fig. 2 Value=10 KΩ

YNSC004

00