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PE45140 Datasheet(PDF) 5 Page - Peregrine Semiconductor |
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PE45140 Datasheet(HTML) 5 Page - Peregrine Semiconductor |
5 / 12 page Preliminary Specification PE45140 Page 5 of 12 Document No. DOC-44014-3 │ www.psemi.com ©2014 Peregrine Semiconductor Corp. All rights reserved. Thermal Data When limiting high power RF signals, the junction temperature of the power limiter can rise significantly. Special consideration needs to be made in the design of the PCB to properly dissipate the heat away from the part and maintain the +270°C maximum junction temperature. It is recommended to use best design practices for high power QFN packages: multi-layer PCBs with thermal vias in a thermal pad soldered to the slug of the package. Special care also needs to be made to alleviate solder voiding under the part. Table 5. Theta JC Parameter Min Typ Max Unit Theta JC 16 °C/W |
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