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TLP504A Datasheet(PDF) 2 Page - Toshiba Semiconductor |
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TLP504A Datasheet(HTML) 2 Page - Toshiba Semiconductor |
2 / 8 page TLP504A,TLP504A −2 2007-10-01 2 Absolute Maximum Ratings (Ta = 25°C) Rating Characteristic Symbol TLP504A TLP504A −2 Unit Forward current IF 60 50 mA Forward current derating ΔIF / °C −0.7 (Ta ≥ 39°C) −0.5 (Ta ≥ 25°C) mA /°C Pulse forward current IFP 1 (100μs pulse, 100pps) A Reverse voltage VR 5 V Junction temperature Tj 125 °C Collector −emitter voltage VCEO 55 V Emitter −collector voltage VECO 7 V Collector current IC 50 mA Collector power dissipation (1 circuit) PC 150 100 mW Collector power dissipation derating (1 circuit Ta ≥ 25°C) ΔPC / °C −1.5 −1.0 mW /°C Junction temperature Tj 125 °C Storage temperature range Tstg −55~150 °C Operating temperature range Topr −55~100 °C Lead soldering temperature Tsol 260 (10 s) °C Total package power dissipation RT 250 150 mW Total package power dissipation derating (Ta ≥ 25°C) ΔPT / °C −2.5 −1.5 mW / °C Isolation voltage BVS 2500 (AC, 1min., R.H.≤ 60%) (Note 1) Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Device considered a two terminal device: LED side pins shorted together and detector side pins shorted together. Recommended Operating Conditions Characteristics Symbol Min. Typ. Max. Unit Supply voltage VCC ― 5 24 V Forward current IF ― 16 20 mA Collector current IC ― 1 10 mA Operating temperature Topr −25 ― 85 °C Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. |
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