Visit us at

www.anaren.com

USA/Canada:

Toll Free:

Europe:

Asia:

(315) 432-8909

(800) 411-6596

+44 2392-232392

+86 512-62749282

Model BD0205F5050AHF

Rev A

Mounting Configuration:

In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be

used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet

published specifications.

All of the Xinger components are constructed from organic PTFE based composites which possess excellent

electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and

ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.

An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the

transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying

pick and place equipment tolerances.

Mounting Footprint

Dimensions are in Millimeters

Circuit Pattern

Footprint Pad (s)

Solder Resist

1.01 2x

4.02

.29 6x

.21 4x

.36 10x

.29 10x

3x

Transmission

Line

Plated thru

hole(s) to

Ground

1.66 2x

.89 4x

PART ORIENTATION (TOP VIEW)