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EP1AGX90 Datasheet(PDF) 38 Page - Altera Corporation

Part # EP1AGX90
Description  Package Information Datasheet for Mature Altera Devices
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Manufacturer  ALTERA [Altera Corporation]
Direct Link  http://www.altera.com
Logo ALTERA - Altera Corporation

EP1AGX90 Datasheet(HTML) 38 Page - Altera Corporation

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38
Package Information Datasheet for Mature Altera Devices
Thermal Resistance
Package Information Datasheet for Mature Altera Devices
© December 2011
Altera Corporation
ACEX 1K Devices Thermal Resistance
Table 38 provides thermal resistance values for ACEX 1K devices.
EP20K1500E
BGA (Cu lid)
652
0.1
8.2
6.9
5.5
4.4
BGA (AlSiC lid)
0.2
9.2
7.3
5.8
4.8
FBGA
652
0.1
9.2
7.3
5.8
4.8
FBGA w/ fin (1)
652
0.5
4.0
3.0
2.5
2.0
FBGA (Cu lid)
1,020
0.1
9.6
7.6
6.2
5.1
FBGA (AlSiC lid)
0.2
10.1
8.1
6.4
5.3
FBGA w/ fin (1)
1,020
0.5
5.0
3.0
2.5
2.0
Note to Table 37:
(1) “fin” is an extra heat sink that customers can add to the device. Several vendors make heat sinks, and they all have different sizes. Altera
performed the thermal calculations in Table 37 using the following fin specifications: width: 0.25 mm; height: 7.0 mm; pitch: 1.5 mm; base
thickness: 0.5 mm.
Table 37. Thermal Resistance of APEX 20KE, 20KC, and 20K Devices (Part 3 of 3)
Device
Package
Pin
Count
JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
Table 38. Thermal Resistance of ACEX 1K Devices
Device
Package
Pin
Count
JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EP1K10
TQFP
100
11.0
37.0
35.0
33.0
29.0
TQFP
144
8.0
31.0
29.0
28.0
25.0
PQFP
208
6.0
30.0
29.0
27.0
22.0
FBGA
256
12.0
37.0
35.0
33.0
30.0
EP1K30
TQFP
144
8.0
28.0
27.0
26.0
24.0
PQFP
208
5.0
30.0
28.0
26.0
21.0
FBGA
256
9.0
31.0
29.0
28.0
25.0
EP1K50
TQFP
144
7.0
26.0
25.0
24.0
23.0
PQFP
208
5.0
29.0
28.0
25.0
20.0
FBGA
256
7.0
30.0
28.0
27.0
24.0
FBGA
484
5.0
25.0
24.0
23.0
22.0
EP1K100
PQFP
208
5.0
28.0
26.0
23.0
18.0
FBGA
256
6.0
28.0
26.0
25.0
23.0
FBGA
484
5.0
24.0
23.0
22.0
21.0


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