EP1AGX90 datasheet(49/182 Pages) ALTERA

Part #	EP1AGX90

Description	Package Information Datasheet for Mature Altera Devices

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Manufacturer	ALTERA [Altera Corporation]

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Package Information Datasheet for Mature Altera Devices

49

Altera Corporation

Package Information Datasheet for Mature Altera Devices

32-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond

■

All dimensions and tolerances conform to ASME Y14.5M – 1994.

■

Controlling dimension is in millimeters.

■

Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description

Specification

Ordering Code Reference

T

Package Acronym

TQFP

Leadframe Material

Copper

Lead Finish (Plating)

Regular: 85Sn:15Pb (Typ.)

Pb-free: Matte Sn

JEDEC Outline Reference

MS-026 Variation: ABA

Lead Coplanarity

0.004 inches (0.1mm)

Weight

0.2 g (Typ.)

Moisture Sensitivity Level

Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min.

Nom.

Max.

A

—

1.20

A1

0.05

—

0.15

A2

0.95

1.00

1.05

D

9.00 BSC

D1

7.00 BSC

E

9.00 BSC

E1

7.00 BSC

L

0.45

0.60

0.75

L1

1.00 REF

S

0.20

—

b

0.30

0.37

0.45

c

0.09

—

0.20

e

0.80 BSC



0



3.5



7



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